Substrate liquid processing apparatus and substrate liquid processing method

Patent metadata

Field	Value
Publication number	US-12209314-B2
Application number	US-202017754379-A
Country	US
Kind code	B2
Filing date	Sep 23, 2020
Priority date	Oct 2, 2019
Publication date	Jan 28, 2025
Grant date	Jan 28, 2025

Abstract

A technique enabling to heat a plating liquid rapidly while suppressing thermal deterioration of the plating liquid is provided. A substrate liquid processing apparatus includes a substrate holder configured to hold a substrate; a plating liquid supply configured to supply the plating liquid on a processing surface of the substrate; and a heating element, configured to heat at least one of the plating liquid on the processing surface or the substrate, including a heater, a liquid flow path through which pure water flows, and a vapor discharge opening which is connected to the liquid flow path and through which water vapor produced as the pure water is vaporized by heat from the heater is ejected.

First claim

I claim:

1. A substrate liquid processing apparatus, comprising:
a substrate holder configured to hold a substrate;
a plating liquid supply configured to supply a plating liquid on a processing surface of the substrate; and
a heating element, configured to heat at least one of the plating liquid on the processing surface or the substrate, comprising a cover body, a heater, a liquid flow path provided horizontally within the cover body, extended in a horizontal direction of the cover body and through which pure water flows, and a vapor discharge opening which extends vertically from the liquid flow path in a vertical direction of the cover body and connected to the liquid flow path and through which water vapor produced as the pure water is vaporized by heat from the heater is ejected,
wherein the cover body, in which the heater, the liquid flow path, and the vapor discharge opening are provided, is configured to cover the processing surface, and the vapor discharge opening of the cover body ejects the water vapor into a gap between the processing surface and the cover body.

2. The substrate liquid processing apparatus of claim 1 ,
wherein the heating element comprises a lower cover body, in which a lower heater, a lower liquid flow path, and a lower vapor discharge opening are provided, configured to cover the substrate from below, and
the lower vapor discharge opening of the lower cover body ejects the water vapor toward the substrate.

3. The substrate liquid processing apparatus of claim 1 ,
wherein the heating element ejects the water vapor toward an outer periphery of the substrate.

4. The substrate liquid processing apparatus of claim 1 , further comprising:
a pure water supply connected to the liquid flow path;
a flow rate control valve configured to adjust a supply amount of the pure water from the pure water supply into the liquid flow path; and
a vapor ejection controller configured to control at least one of the heater or the flow rate control valve to adjust ejection of the water vapor from the vapor discharge opening,
wherein the vapor ejection controller controls the flow rate control valve such that an appropriate amount of the pure water exists in the liquid flow path while the water vapor is being discharged from the vapor discharge opening.

5. The substrate liquid processing apparatus of claim 4 ,
wherein the processing surface includes multiple processing regions,
the vapor discharge opening includes multiple vapor discharge openings, and one or more vapor discharge openings are provided for each of the multiple processing regions, and
the vapor ejection controller adjusts the ejection of the water vapor from the multiple vapor discharge openings for each of the multiple processing regions.

6. The substrate liquid processing apparatus of claim 5 ,
wherein the liquid flow path includes multiple division flow paths respectively corresponding to the multiple processing regions, and
the vapor ejection controller controls the flow rate control valve to adjust the supply amount of the pure water into each of the multiple division flow paths.

7. The substrate liquid processing apparatus of claim 5 ,
wherein the heater includes multiple division heater sections respectively corresponding to the multiple processing regions, and
the vapor ejection controller controls the heater to adjust heat generation of each of the multiple division heater sections.

8. The substrate liquid processing apparatus of claim 1 , further comprising:
a gas supply connected to the liquid flow path, and configured to supply a gas into the liquid flow path.

9. A substrate liquid processing method, comprising:
supplying a plating liquid on a processing surface of a substrate; and
heating the plating liquid on the processing surface by a heating element having a cover body, a heater, a liquid flow path provided horizontally within the cover body, and a vapor discharge opening which extends vertically from the liquid flow path in a vertical direction of the cover body,
wherein in the heating of the plating liquid, water vapor, which is produced as pure water flown into the liquid flow path is vaporized by heat from the heater and is then ejected from the vapor discharge opening, is used to heat the plating liquid on the processing surface,
wherein the cover body is configured to cover the processing surface, and
the vapor discharge opening of the cover body ejects the water vapor into a gap between the processing surface and the cover body.

10. A substrate liquid processing method, comprising:
heating a substrate by a heating element having a cover body, a heater, a liquid flow path provided horizontally within the cover body, and a vapor discharge opening which extends vertically from the liquid flow path in a vertical direction of the cover body, wherein water vapor, which is produced as pure water flown into the liquid flow path is vaporized by heat from the heater and is then ejected from the vapor discharge opening, is used to heat the substrate; and
supplying a plating liquid on a processing surface of the substrate heated by using the water vapor,
wherein the cover body is configured to cover the processing surface, and
the vapor discharge opening of the cover body ejects the water vapor into a gap between the processing surface and the cover body.

11. A substrate liquid processing method, comprising:
supplying a heating medium liquid on a substrate;
heating a substrate through the heating medium liquid on the substrate by a heating element having a cover body, a heater, a liquid flow path provided horizontally within the cover body, and a vapor discharge opening which extends vertically from the liquid flow path in a vertical direction of the cover body; and
supplying a plating liquid on a processing surface of the substrate heated through the heating medium liquid,
wherein in the heating of the substrate, water vapor, which is produced as pure water flown into the liquid flow path is vaporized by heat from the heater and is then ejected from the vapor discharge opening, is used to heat the heating medium liquid on the substrate to thereby heat the substrate,
wherein the cover body is configured to cover the processing surface, and
the vapor discharge opening of the cover body ejects the water vapor into a gap between the processing surface and the cover body.

Assignees

• Tokyo Electron Ltd

Inventors

• Kaneko Satoshi

Classifications

• C23C18/1628

  Specific elements or parts of the apparatus · CPC title

• B05C5/001

  incorporating means for heating or cooling the liquid or other fluent material (B05C11/1042 takes precedence) · CPC title

• C23C18/163

  Supporting devices for articles to be coated · CPC title

• C23C18/1669

  Agitation, e.g. air introduction · CPC title

• C23C18/1678

  Heating of the substrate · CPC title