System and method for performing localized electroless nickel plating

US2025051926A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2025051926-A1
Application numberUS-202218723709-A
CountryUS
Kind codeA1
Filing dateDec 23, 2022
Priority dateDec 30, 2021
Publication dateFeb 13, 2025
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A system for performing electroless nickel plating on a portion of a metallic piece comprises a chamber fixedly coupled to the metallic piece during operation of the system so that the portion of the metallic piece and the chamber define a closed volume. The chamber has an inlet to supply at least a plating fluid into the volume and an outlet to discharge the plating fluid from the volume, so that the portion of the metallic piece is exposed to the plating fluid and is plated.

First claim

Opening claim text (preview).

1 . A system for performing electroless nickel plating on a portion of a metallic piece, the system comprising: a chamber having an inlet and an outlet, the chamber being configured to be fixedly coupled to the metallic piece so that the portion of the metallic piece and the chamber together define a closed volume; wherein the inlet is configured to supply at least a first fluid into the volume, wherein the first fluid is a plating fluid and the portion of the metallic piece is exposed to the plating fluid for plating, wherein the outlet is configured to discharge the first fluid from the volume, and wherein the first fluid is supplied and discharged in a continuous way. 2 . The system of claim 1 , wherein the chamber is rigid, in particular in the form of a bowl or a jar. 3 . The system of claim 1 , wherein the chamber is flexible, in particular in the form of a sheet or a shell. 4 . The system of claim 1 , wherein at least a portion of the chamber is made of a glass or a metal or a metallic alloy. 5 . The system of claim 1 , wherein at least a portion of the chamber is made of a silicone or a fluoroelastomer or a polymer able to resist temperatures of at least 80° C., preferably temperatures of 85° C.-95° C., more preferably temperatures of 88° C.-92° C. 6 . The system of claim 1 , wherein at least a portion of the chamber is made of a transparent or translucent material. 7 . The system of claim 1 , further comprising a fixing member, in particular an adhesive or a magnet or a weight, configured to fixedly couple the chamber to the portion of the metallic piece. 8 . The system of claim 1 , further comprising a sealing member attached to the chamber and configured to surround the portion of the metallic piece. 9 . The system of claim 1 , further comprising a recirculation fluidly coupled to the inlet and the outlet-lit, and configured to recirculate at least the first fluid from the volume back to the volume. 10 . The system of claim 9 , wherein the recirculation circuit comprises: a pump for pumping at least the plating fluid in the recirculation circuit; and at least a first tank for storing the plating fluid. 11 . The system of claim 9 , wherein the recirculation circuit is configured to recirculate at least one second fluid from the volume back to the volume, wherein the at least one second fluid is an alkaline fluid or an acid fluid, and wherein the chamber is resistant to the at least one second fluid. 12 . The system of claim 11 , wherein the recirculation circuit further comprises at least a second tank for storing the at least one second fluid. 13 . A method for performing an electroless nickel plating on a portion of a metallic piece, the method comprising the steps of: B) covering with a chamber to define a closed volume; C) fixing the chamber to the metallic piece; F) supplying a plating fluid into the volume through an inlet of the chamber; G) discharging the plating fluid from the volume through an outlet of the chamber; and H) removing the chamber from the metallic piece, wherein step F and step G are performed simultaneously. 14 . The method of claim 13 , further comprising a step D of supplying a cleaning fluid into the volume through an inlet of the chamber and a step E of discharging the cleaning fluid from the volume through an outlet of the chamber, wherein step D and step E are performed before step F. 15 . The method of claim 13 , further comprising a step A of treating the portion of the metallic piece with a chemical and/or mechanical treatment, wherein step A is performed before step B, and wherein the chemical and/or mechanical treatment realizes cleaning of the portion of a metallic piece. 16 . The method of claim 13 , further comprising a step I of heating the portion of the metallic piece, wherein step I starts before or during step F and ends during or after step G, and wherein during step I the portion of the metallic piece is heated up to at least 80° C., preferably up to 85° C.-95° C., more preferably up to 88° C.-92° C.

Assignees

Inventors

Classifications

  • Coating with nickel, cobalt or mixtures thereof with phosphorus or boron (C23C18/50 takes precedence) · CPC title

  • by chemical pretreatment · CPC title

  • Apparatus for cleaning or pickling metallic material (with organic solvents C23G5/04) · CPC title

  • Heating of the substrate · CPC title

  • Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells · CPC title

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What does patent US2025051926A1 cover?
A system for performing electroless nickel plating on a portion of a metallic piece comprises a chamber fixedly coupled to the metallic piece during operation of the system so that the portion of the metallic piece and the chamber define a closed volume. The chamber has an inlet to supply at least a plating fluid into the volume and an outlet to discharge the plating fluid from the volume, so t…
Who is the assignee on this patent?
Nuovo Pignone Tecnologie Srl
What technology area does this patent fall under?
Primary CPC classification C23C18/1603. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Feb 13 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).