Substrate processing apparatus and substrate processing method

Patent metadata

Field	Value
Publication number	US-2023098105-A1
Application number	US-202117908693-A
Country	US
Kind code	A1
Filing date	Feb 18, 2021
Priority date	Mar 4, 2020
Publication date	Mar 30, 2023
Grant date	—

Abstract

A substrate processing apparatus 5 includes a holder 52 (52A), a supply 53 and a cover body 6. The holder 52 (52A) is configured to attract and hold a substrate W. The supply 53 is configured to supply a heated plating liquid to the substrate W attracted to and held by the holder 52 (52A). The cover body 6 is configured to cover the substrate W attracted to and held by the holder 52 (52A), and heat the plating liquid on the substrate W by using a heating device 63 provided in a ceiling member 61 thereof facing a top surface of the substrate W. The holder 52 (52A) includes protrusions 130 projecting from a facing surface 110 thereof facing a bottom surface of the substrate W toward the bottom surface of the substrate W, and each protrusion has a protruding height equal to or larger than 1 mm.

First claim

1 . A substrate processing apparatus, comprising:
a holder configured to attract and hold a substrate; a supply configured to supply a heated plating liquid to the substrate attracted to and held by the holder; and a cover body configured to cover the substrate attracted to and held by the holder, and configured to heat the plating liquid on the substrate by using a heating device provided in a ceiling member thereof facing a top surface of the substrate, wherein the holder is provided with multiple protrusions projecting from a facing surface thereof facing a bottom surface of the substrate toward the bottom surface of the substrate, and each protrusion has a protruding height equal to or larger than 1 mm.

2 . The substrate processing apparatus of claim 2 ,
wherein the multiple protrusions have an annular shape when viewed from a top, and are arranged concentrically.

3 . The substrate processing apparatus of claim 2 ,
wherein a first width, which is a width of the protrusion in a diametrical direction, is smaller than a second width which is a width between the adjacent protrusions in the diametrical direction.

4 . The substrate processing apparatus of claim 3 ,
wherein a ratio of the first width to the second width is equal to or less than 0.1.

5 . The substrate processing apparatus of claim 1 ,
wherein the heating device comprises multiple individual heating elements that are arranged concentrically and configured to be temperature-controlled individually.

6 . The substrate processing apparatus of claim 5 ,
wherein the holder has a diameter smaller than that of the substrate, and is disposed to be concentric with the multiple individual heating elements, and when a first heating element located directly above the holder among the multiple individual heating elements is assumed to have a diameter A and a distance between the first heating element and a second heating element adjacent to the first heating element among the multiple individual heating elements is assumed to be a distance B, the diameter of the holder may be equal to or larger than A−(B/2) and equal to or less than A+(B/2).

7 . The substrate processing apparatus of claim 6 ,
wherein the diameter of the holder is equal to the diameter of the first heating element.

8 . The substrate processing apparatus of claim 1 ,
wherein the holder is made of a carbon PEEK resin.

9 . A substrate processing apparatus, comprising:
a holder configured to attract and hold a substrate; and a supply configured to supply a processing liquid to the substrate attracted to and held by the holder, wherein the holder is provided with multiple protrusions projecting from a facing surface thereof facing a bottom surface of the substrate toward the bottom surface of the substrate, and each protrusion has a protruding height equal to or larger than 1 mm.

10 . A substrate processing method, comprising:
attracting and holding a substrate by using a holder which is provided with multiple protrusions projecting from a facing surface thereof positioned under the substrate toward a bottom surface of the substrate, and each protrusion having a protruding height equal to or larger than 1 mm; supplying a heated plating liquid to the attracted/held substrate; covering the substrate with a cover body before or after the supplying of the plating liquid; and heating the plating liquid on the substrate by using a heating device provided in a ceiling member of the cover body facing a top surface of the substrate, while keeping the substrate covered with the cover body.

11 . A substrate processing method, comprising:
attracting and holding a substrate by using a holder which is provided with multiple protrusions each projecting from a facing surface thereof positioned under the substrate toward a bottom surface of the substrate, and each protrusion having a protruding height equal to or larger than 1 mm; and supplying a processing liquid to the attracted/held substrate.

Assignees

• Tokyo Electron Ltd

Inventors

• Inatomi Yuichiro
• Hashimoto Yusaku
• Niwa Takafumi

Classifications

• H10P14/46

  using a liquid · CPC title

• B05B13/02

  Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work (B05B13/06 takes precedence) · CPC title

• B05C11/1015

  responsive to a conditions of ambient medium or target, e.g. humidity, temperature (B05C11/1005 takes precedence); responsive to position or movement of the coating head relative to the target · CPC title

• C23C18/1676

  Heating of the solution · CPC title

• C23C18/168

  Control of temperature, e.g. temperature of bath, substrate · CPC title