Power-module substrate unit and power module
US-9837363-B2 · Dec 5, 2017 · US
of one or more of the metallic layers or articles
of one or more of the metallic layers or articles · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C04B2237/706 |
| Official title | of one or more of the metallic layers or articles |
| Display label | of one or more of the metallic layers or articles |
| Total patents | 236 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 20 |
| 2016 | 16 |
| 2017 | 24 |
| 2018 | 22 |
| 2019 | 21 |
| 2020 | 23 |
| 2021 | 24 |
| 2022 | 25 |
| 2023 | 22 |
| 2024 | 21 |
| 2025 | 17 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Bonded substrate and method for manufacturing bonded substrate
US-2017323842-A1 · Nov 9, 2017 · US
Substrate for power modules, substrate with heat sink for power modules, and power module
US-9807865-B2 · Oct 31, 2017 · US
Power-module substrate with cooler and method of producing the same
US-2017309499-A1 · Oct 26, 2017 · US
Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Connector, Terminal, Laminate, Shield Material, Printed-Wiring Board, Metal Processed Member, Electronic Device and Method for Manufacturing the Printed Wiring Board
US-2017291397-A1 · Oct 12, 2017 · US
Power module substrate, heat-sink-attached power-module substrate, and heat-sink-attached power module
US-9786577-B2 · Oct 10, 2017 · US
Brazing material, brazing material paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module
US-9780011-B2 · Oct 3, 2017 · US
Power semiconductor substrates with metal contact layer and method of manufacture thereof
US-9768036-B2 · Sep 19, 2017 · US
Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board
US-9724896-B2 · Aug 8, 2017 · US
Apparatus and method for producing (metal plate)-(ceramic board) laminated assembly, and apparatus and method for producing power-module substrate
US-9725367-B2 · Aug 8, 2017 · US
Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate
US-9723707-B2 · Aug 1, 2017 · US
Target formed of sintering-resistant material of high-melting point metal alloy, high-melting point metal silicide, high-melting point metal carbide, high-melting point metal nitride, or high-melting point metal boride, process for producing the target, assembly of the sputtering target-backing plate, and process for producing the same
US-9677170-B2 · Jun 13, 2017 · US
Metal-on-ceramic substrates
US-2017151755-A1 · Jun 1, 2017 · US
Power-module substrate unit and power module
US-2017154855-A1 · Jun 1, 2017 · US
Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device
US-2017141011-A1 · May 18, 2017 · US
Method for producing ceramic-aluminum bonded body, method for producing power module substrate, ceramic-aluminum bonded body, and power module substrate
US-2017141010-A1 · May 18, 2017 · US
Silicon nitride substrate and method for producing silicon nitride substrate
US-9655237-B2 · May 16, 2017 · US
Ceramic/metal composite structure
US-9586382-B2 · Mar 7, 2017 · US
Manufacturing method of power-module substrate
US-9579739-B2 · Feb 28, 2017 · US
Power-module substrate unit and power module
US-2017053852-A1 · Feb 23, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C04B2237/706?
- CPC C04B2237/706 is the Cooperative Patent Classification code for “of one or more of the metallic layers or articles.”
- How many patents are filed under CPC C04B2237/706 (of one or more of the metallic layers or articles)?
- Our database includes 236 publications tagged with this CPC code.
- Is patent activity under CPC C04B2237/706 growing?
- Publication counts under this code: 21 in 2024 vs 17 in 2025 (latest complete years).