Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device

Patent metadata

Field	Value
Publication number	US-2017141011-A1
Application number	US-201515320441-A
Country	US
Kind code	A1
Filing date	Jun 30, 2015
Priority date	Jul 2, 2014
Publication date	May 18, 2017
Grant date	—

Abstract

A joined body manufacturing method includes: a laminating step for forming a laminated body in which either a copper circuit substrate (first member) or a ceramic substrate (second member) is coated beforehand with a temporary fixing material the main ingredient of which is a saturated fatty acid, the copper circuit substrate and the ceramic substrate are stacked and positioned by the temporary fixing material which has been melted, and by cooling the temporary fixing material the stacked copper substrate and ceramic substrate are temporarily fixed; and a joining step for forming a joined body in which the copper circuit substrate and the ceramic substrate are joined by heating with pressurizing the laminated body in the stacking direction.

First claim

1 . A joined body manufacturing method comprising:
a laminating step forming a laminated body: by coating temporary fixing material including saturated fatty acid as a main ingredient beforehand on either a first member or a second member, wherein the first member is made of a metal plate, and the second member includes one or more of metal plates or ceramic plates; stacking and positioning the first member and the second member with the temporary fixing material therebetween in a state in which the temporary fixing material is melted; and cooling the temporary fixing material, to form the laminated body in which the stacked first member and the second member are temporarily joined; and a joining step forming a joined body in which the first member and the second member are joined by heating with pressurizing the laminated body in a stacking direction.

2 . The joined body manufacturing method according to claim 1 , wherein a carbon number of the saturated fatty acid of the temporary fixing material is larger than or equal to 10 and smaller than or equal to 30.

3 . The joined body manufacturing method according to claim 1 , wherein a joining-material layer is formed on either one surface of the first member or the second member, and the first member and the second member are laminated with the joining-material layer and the temporary fixing material therebetween in the laminating step.

4 . A multilayer joined body manufacturing method applying the joined body manufacturing method according to claim 1 , comprising a second laminating step before the joining step temporarily joining a third member made of a metal plate on the laminated body formed by the laminating step, wherein
in the second laminating step, a second laminated body in which the laminated body and the third member are temporarily joined is formed: by applying a second temporary fixing material including saturated fatty acid with a lower melting point than the temporary fixing material as a main ingredient, on either one of the laminated body or the third body beforehand; melting the second temporary fixing material at lower temperature than melting temperature of the temporary fixing material when stacking the laminated body and the third member; and cooling the second temporary fixing material after positioning and stacking the laminated body and the third body: and in the joining step, by pressurizing and heating the second laminated body in a stacking direction thereof, the multilayer joined body in which the third member is further joined on the joined body in which the first member and the second member are joined.

5 . The multilayer joined body manufacturing method according to claim 4 , wherein a carbon number of the saturated fatty acid of the temporary fixing material is larger than or equal to 10 and smaller than or equal to 30.

6 . The multilayer joined body manufacturing method according to claim 4 , wherein a joining-material layer is formed on either one surface of the first member or the second member, and the first member and the second member are stacked with the joining-material layer and the temporary fixing material therebetween in the laminating step.

7 . The multilayer joined body manufacturing method according to claim 4 , wherein a second joining-material layer is formed on either one surface of the second laminated body or the third member, and the laminated body and the third member are stacked with the second temporary fixing material and the second joining-material layer therebetween in the second laminating step.

8 . A heat sink equipped power-module substrate manufacturing method applying the multilayer joined body manufacturing method according to claim 4 , wherein
the first member is a circuit plate made of copper or aluminum, the second member is a ceramic substrate made by laminating aluminum metal layers on both surfaces of a ceramic plate, the third member is a heat sink made of copper or aluminum, and in the joining step, the heat sink equipped power-module substrate is formed as the multilayer joined body by joining the first member and one of the aluminum metal layers of the second member and joining the third member and the other of the aluminum metal layers of the second member.

9 . The heat sink equipped power-module substrate manufacturing method according to claim 8 , wherein a carbon number of the saturated fatty acid of the temporary fixing material is larger than or equal to 10 and smaller than or equal to 30.

10 . The heat sink equipped power-module substrate manufacturing method according to claim 8 , wherein a joining-material layer is formed on either one surface of the first member or the second member, and the first member and the second member are stacked with the joining-material layer and the temporary fixing material therebetween in the laminating step.

11 . The heat sink equipped power-module substrate manufacturing method according to claim 8 , wherein a second joining-material layer is formed on either one surface of the second laminated body or the third member, and the laminated body and the third member are stacked with the second temporary fixing material and the second joining-material layer therebetween in the second laminating step.

12 . A power-module substrate manufacturing method applying the joined body manufacturing method according to claim 1 , wherein
the first member is a copper circuit plate, the second member is a ceramic substrate made by laminating aluminum metal layers on both surfaces of a ceramic plate, and in the joining step, the power-module substrate is formed as the joined body by joining the first member and one of the aluminum metal layers of the second member.

13 . The power-module substrate manufacturing method according to claim 12 , wherein a carbon number of the saturated fatty acid of the temporary fixing material is larger than or equal to 10 and smaller than or equal to 30.

14 . The power-module substrate manufacturing method according to claim 12 , wherein a joining-material layer is formed on either one surface of the first member or the second member, and the first member and the second member are stacked with the joining-material layer and the temporary fixing material therebetween in the laminating step.

15 . A heat sink equipped power-module substrate manufacturing method applying the joined body manufacturing method according to claim 1 , wherein
the first member is a heat sink made of copper or aluminum, the second member is a power-module substrate formed by laminating metal layers on both surfaces of a ceramic plate, and in the joining step, the heat sink equipped power-module substrate is formed as the joined body by joining the first member and one of the metal layers of the second member.

16 . The heat sink equipped power-module substrate manufacturing method according to claim 15 , wherein a carbon number of the saturated fatty acid of the temporary fixing material is larger than or equal to 10 and smaller than or equal to 30.

17 . The heat sink equipped power-module substrate manufacturing method according to claim 15 , wherein
a joining-material layer is formed on either one surface of the first member or the second member, and in the laminating step, the first member and the second member are stacked with the joining-material layer and the temporary fixing material therebetween.

18 . The heat sink equipped power-module substrate manufacturing method according to claim 17 , wherein
before the laminating step, the joining-material layer is temporary joi

Assignees

• Mitsubishi Materials Corp

Inventors

• Oohiraki Tomoya
• Oi Sotaro
• Nishikawa Kimihito

Classifications

• B32B2307/732

  Dimensional properties · CPC title

• B32B7/04

  Interconnection of layers · CPC title

• B32B9/005

  comprising one layer of ceramic material, e.g. porcelain, ceramic tile (layered products with at least two ceramic layers composed mainly of ceramic B32B18/00) · CPC title

• C04B2237/706

  of one or more of the metallic layers or articles · CPC title

• B32B9/041

  of metal · CPC title