Brazing material, brazing material paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module

Patent metadata

Field	Value
Publication number	US-9780011-B2
Application number	US-201214127476-A
Country	US
Kind code	B2
Filing date	Jul 2, 2012
Priority date	Jun 30, 2011
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

To provide a brazing material for maintaining bonding strength between ceramic substrate and metal plate at a conventionally attainable level, while addition amount of In is reduced, and a brazing material paste using the same. A mixture powder provided by mixing alloy powder composed of Ag, In, and Cu, Ag powder, and active metal hydride powder, the mixture powder containing active metal hydride powder with a 10-to-25-μm equivalent circle average particle diameter by 0.5 to 5.0 mass %, the equivalent circle average particle diameters for the alloy powder, Ag powder, and active metal hydride powder having a relationship: alloy powder≧active metal hydride powder>Ag powder, and the powder mixture having a particle size distribution of d10 of 3 to 10 μm, d50 of 10 to 35 μm, and d90 of 30 to 50 μm, and in the frequency distribution, a peak of the distribution existing between d50 and d90.

First claim

The invention claimed is:

1. A brazing material for bonding between a ceramic substrate and a metal plate, comprising:
an alloy powder composed of at least 55 to 80 mass % of Ag, 1 to 5 mass % of In, and the balance Cu with inevitable impurities,
an Ag powder, and
an active metal hydride powder formed separately from said alloy powder and from said Ag powder,
wherein a composition ratio of Ag to the total amount of Ag and Cu contained in said powder mixture, Ag/(Ag+Cu), being 0.57 to 0.85,
the brazing material containing an active metal hydride powder with an equivalent circle average diameter of particles of 10 to 25 μm by 0.27 to 5.17 mass %,
the equivalent circle average diameters of particles for said alloy powder, Ag powder, and active metal hydride powder meeting a relationship of alloy powder>active metal hydride powder>Ag powder, and
in the cumulative distribution in volume base given upon a measurement of the particle size distribution in conformity with JIS Z 8825-1, said powder mixture having a particle size distribution of a cumulative 10% particle diameter (d10) of 3 to 10 μm, a cumulative 50% particle diameter (d50) of 10 to 35 μm, and a cumulative 90% particle diameter (d90) of 29.4 to 50 μm, and in the frequency distribution, a peak existing between the cumulative 50% particle diameter (d50) and the cumulative 90% particle diameter (d90), and
wherein the brazing material has a bulk density of 3.6 to 5.5 g/cm 3 .

2. The brazing material according to claim 1 , wherein said peak exists between a cumulative 60% particle diameter (d60) and a cumulative 80% particle diameter (d80).

3. The brazing material according to claim 2 , wherein the value of (d50−d10)/(d90−d10) is 0.25 to 0.65.

4. The brazing material according to claim 2 , wherein the value of (d50−d10)/40% is 0.15 to 0.65 μm/%.

5. The brazing material according to claim 1 , wherein the bulk density is 3.84 to 4.12 g/cm 3 .

6. The brazing material according to claim 5 , wherein the value of (d50−d10)/(d90−d10) is 0.25 to 0.65.

7. The brazing material according to claim 1 , wherein the value of (d50−d10)/(d90−d10) is 0.25 to 0.65.

8. The brazing material according to claim 1 , wherein the value of (d50−d10)/40% is 0.15 to 0.65 μm/%.

9. The brazing material according to claim 1 , comprising: an alloy powder with a cumulative 50% particle diameter (d50) of 15 to 40 μm composed of 55 to 80 mass % of Ag, 1 to 5 mass % of In, 0.1 mass % or under of oxygen content, and the balance Cu with inevitable impurities; 5 to 30 pts. mass of Ag powder particles with a cumulative 50% particle diameter (d50) of 1 to 15 μm for 100 pts. mass of said alloy powder; and 0.27 to 5.17 pts. mass of an active metal hydride powder having a particle size distribution of a cumulative 10% particle diameter (d10) of 5 to 15 μm, a cumulative 50% particle diameter (d50) of 10 to 25 μm, and a cumulative 90% particle diameter (d90) of 25 to 50 μm.

10. The brazing material according to claim 1 , wherein said active metal hydride powder is a titanium hydride powder.

11. The brazing material according to claim 1 , wherein the ratio of Ag to the total amount of Ag and Cu contained in said alloy powder, Ag/(Ag+Cu), is 0.6 to 0.7.

12. The brazing material according to claim 1 , wherein said alloy powder contains 0.0001 to 0.5 mass % of Si.

13. The brazing material according to claim 1 , wherein the cumulative 10% particle diameter (d10) of said alloy powder is 6 to 12 μm, and the cumulative 90% particle diameter (d90) of the same is 60 μm or under.

14. The brazing material according to claim 1 , wherein the cumulative 10% particle diameter (d10) of said Ag powder is 0.5 to 3.0 μm, and the cumulative 90% particle diameter (d90) of the same is 8.0 to 20 μm or under.

15. A brazing material paste obtained by adding a binder by 1 to 10 mass %, and a solvent by 2 to 20 mass % to any one of the brazing materials according to claim 1 , and kneading a resulting mixture.

16. A brazing material for bonding between a ceramic substrate and a metal plate, comprising:
an alloy powder composed of at least 55 to 80 mass % of Ag, 1 to 5 mass % of In, and the balance Cu with inevitable impurities,
an Ag powder, and
an active metal hydride powder formed separately from said alloy powder and from said Ag powder,
wherein a composition ratio of Ag to the total amount of Ag and Cu contained in said powder mixture, Ag/(Ag+Cu), being 0.57 to 0.85,
the brazing material containing an active metal hydride powder with an equivalent circle average diameter of particles of 10 to 25 μm by 0.27 to 5.17 mass %,
the equivalent circle average diameter of particles for the alloy powder is larger than the equivalent average diameter of particles for the active metal hydride powder by 2.8 mm or more, and
in the cumulative distribution in volume base given upon a measurement of the particle size distribution in conformity with JIS Z 8825-1, said powder mixture having a particle size distribution of a cumulative 10% particle diameter (d10) of 3 to 10 μm, a cumulative 50% particle diameter (d50) of 10 to 35 μm, and a cumulative 90% particle diameter (d90) of 29.4 to 50 μm, and in the frequency distribution, a peak existing between the cumulative 50% particle diameter (d50) and the cumulative 90% particle diameter (d90), and
wherein the brazing material has a bulk density of 3.6 to 5.5 g/cm 3 .

Assignees

• Imamura Hisayuki
• Fujita Suguru
• Watanabe Junichi
• Hitachi Metals Ltd

Inventors

• Imamura Hisayuki
• Fujita Suguru
• Watanabe Junichi

Classifications

• H10W70/692

  Ceramics or glasses · CPC title

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W40/00 Primary

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• Y10T428/12014

  having metal particles · CPC title

• C04B37/026

  consisting of metals or metal salts · CPC title