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Ceramic/metal composite structure
US9586382B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9586382-B2 |
| Application number | US-201213354176-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 19, 2012 |
| Priority date | Jan 24, 2008 |
| Publication date | Mar 7, 2017 |
| Grant date | Mar 7, 2017 |
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- Title
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Abstract
Official abstract text for this publication.
A ceramic/metal composite structure includes an aluminum oxide substrate, an interface bonding layer and a copper sheet. The interface bonding layer is disposed on the aluminum oxide substrate. The copper sheet is disposed on the interface bonding layer. The interface bonding layer bonds the aluminum oxide substrate to the copper sheet. Some pores are formed near or in the interface bonding layer. A porosity of the interface bonding layer is substantially smaller than or equal to 25%.
First claim
Opening claim text (preview).
What is claimed is: 1. A ceramic/metal composite structure, comprising: an aluminum oxide substrate; an interface bonding layer directly disposed on the aluminum oxide substrate; and a copper sheet directly disposed on the interface bonding layer and entirely separated from the aluminum oxide substrate by the interface bonding layer, wherein the interface bonding layer directly bonds the aluminum oxide substrate to the copper sheet and has a plurality of pores, and a porosity of the interface bonding layer is substantially smaller than or equal to 25% and substantially greater than or equal to 1%. 2. The ceramic/metal composite structure according to claim 1 , wherein a material of the aluminum oxide substrate is polycrystalline 96% aluminum oxide. 3. The ceramic/metal composite structure according to claim 1 , wherein a material of the aluminum oxide substrate is sapphire. 4. The ceramic/metal composite structure according to claim 1 , wherein a material of the interface bonding layer is a copper-nickel-phosphorus alloy. 5. The ceramic/metal composite structure according to claim 1 , wherein a material of the interface bonding layer is a copper-nickel-boron alloy. 6. The ceramic/metal composite structure according to claim 1 , wherein the porosity of the interface bonding layer is substantially smaller than or equal to 10%. 7. The ceramic/metal composite structure according to claim 1 , wherein the porosity of the interface bonding layer is substantially smaller than or equal to 6%. 8. The ceramic/metal composite structure according to claim 1 , wherein the interface bonding layer is interposed between the aluminum oxide substrate and the copper sheet. 9. The ceramic/metal composite structure according to claim 1 , wherein the aluminum oxide substrate is separated from the copper sheet by the interface bonding layer. 10. The ceramic/metal composite structure according to claim 1 , wherein an interface surface between the copper sheet and the interface bonding layer and an interface surface between the interface bonding layer and the aluminum oxide substrate extend in substantially the same direction. 11. The ceramic/metal composite structure according to claim 1 , wherein the aluminum oxide substrate, the interface bonding layer and the copper sheet are stacked in order. 12. The ceramic/metal composite structure according to claim 1 , wherein the porosity of the interface bonding layer is substantially greater than or equal to 2%. 13. The ceramic/metal composite structure according to claim 1 , wherein the porosity of the interface bonding layer is substantially greater than or equal to 6%. 14. The ceramic/metal composite structure according to claim 1 , wherein the porosity of the interface bonding layer is substantially greater than or equal to 9%.
Assignees
Inventors
Classifications
having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title
Silica or silicates · CPC title
Aluminium nitride · CPC title
of one or more of the metallic layers or articles · CPC title
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9586382B2 cover?
- A ceramic/metal composite structure includes an aluminum oxide substrate, an interface bonding layer and a copper sheet. The interface bonding layer is disposed on the aluminum oxide substrate. The copper sheet is disposed on the interface bonding layer. The interface bonding layer bonds the aluminum oxide substrate to the copper sheet. Some pores are formed near or in the interface bonding lay…
- Who is the assignee on this patent?
- Tuan Wei-Hsing, Lee Shao-Kuan, Univ Nat Taiwan
- What technology area does this patent fall under?
- Primary CPC classification B32B15/20. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Mar 07 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).