Substrate for power modules, substrate with heat sink for power modules, and power module
US-2016021729-A1 · Jan 21, 2016 · US
Power module substrate, heat-sink-attached power-module substrate, and heat-sink-attached power module
US9786577B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9786577-B2 |
| Application number | US-201515305689-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 24, 2015 |
| Priority date | Apr 25, 2014 |
| Publication date | Oct 10, 2017 |
| Grant date | Oct 10, 2017 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A power-module substrate including a circuit layer having a first aluminum layer bonded on one surface of a ceramic substrate and a first copper layer bonded on the first aluminum layer by solid-phase-diffusion bonding, and a metal layer having a second aluminum layer made from a same material as the first aluminum layer and bonded on the other surface of the ceramic substrate and a second copper layer made from a same material as the first copper layer and bonded on the second aluminum layer by solid-phase-diffusion bonding, in which a thickness t 1 of the first copper layer is 1.7 mm to 5 mm, a sum of the thickness t 1 of the first copper layer and a thickness t 2 of the second copper layer is 7 mm or smaller, and a ratio t 2 /t 1 is larger than 0 and 1.2 or smaller except for a range of 0.6 to 0.8.
First claim
Opening claim text (preview).
The invention claimed is: 1. A power-module substrate comprising a circuit layer which is stacked on one surface of a ceramic substrate and a metal layer which is stacked on the other surface of the ceramic substrate, wherein the circuit layer comprises a first aluminum layer which is bonded on the one surface of the ceramic substrate and a first copper layer which is bonded on the first aluminum layer by solid-phase-diffusion bonding, the metal layer comprises a second aluminum layer, which is made from a same material as that of the first aluminum layer and bonded on the other surface for the ceramic substrate, and a second copper layer, which is made from a same material as that of the first copper layer and bonded on the second aluminum layer by solid-phase-diffusion bonding, a thickness t 1 of the first copper layer is 1.7 mm or larger and 5 mm or smaller (1.7 mm≦t 1 ≦5 mm), a sum of the thickness t 1 of the first copper layer and a thickness t 2 of the second copper layer is 7 mm or smaller (t 1 +t 2 ≦7 mm), and a ratio t 2 /t 1 between the thickness t 1 of the first copper layer and the thickness t 2 of the second copper layer is in a range larger than 0 and 1.2 or smaller (0<t 2 /t 1 ≦1.2), except for a range of 0.6 or larger and 0.8 or smaller (0.6≦t 2 /t 1 ≦0.8). 2. A heat-sink-attached power-module substrate comprising the power-module substrate and a heat sink which is bonded on the second copper layer according to claim 1 . 3. A heat-sink-attached power module comprising the heat-sink-attached power-module substrate and a semiconductor element which is bonded on the circuit layer according to claim 2 .
Assignees
Inventors
Classifications
comprising metals or metalloids, e.g. solders · CPC title
Die-attach connectors · CPC title
by flowing liquids, e.g. forced water cooling · CPC title
Assembling together parts thereof · CPC title
characterised by their shape, e.g. having conical or cylindrical projections · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9786577B2 cover?
- A power-module substrate including a circuit layer having a first aluminum layer bonded on one surface of a ceramic substrate and a first copper layer bonded on the first aluminum layer by solid-phase-diffusion bonding, and a metal layer having a second aluminum layer made from a same material as the first aluminum layer and bonded on the other surface of the ceramic substrate and a second copp…
- Who is the assignee on this patent?
- Mitsubishi Materials Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W40/255. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 10 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).