Semiconductor device
US-2015380338-A1 · Dec 31, 2015 · US
Apparatus and method for producing (metal plate)-(ceramic board) laminated assembly, and apparatus and method for producing power-module substrate
US9725367B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9725367-B2 |
| Application number | US-201414780779-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 18, 2014 |
| Priority date | Mar 29, 2013 |
| Publication date | Aug 8, 2017 |
| Grant date | Aug 8, 2017 |
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- Title
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Abstract
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Provided are: an apparatus and a method for producing a (metal plate)-(ceramic board) laminated assembly, a bonding material and a metal plate during the bonding of the metal plate to the ceramic board through the bonding-material layer and an apparatus and a method for producing a power-module substrate. An apparatus for producing a (metal plate)-(ceramic board) laminated assembly by laminating a metal plate having a temporary bonding material formed thereon on a ceramic board having a bonding-material layer formed thereon, the apparatus being equipped with: a conveying device which conveys the metal plate onto the ceramic board to laminate the ceramic board and the metal plate on each other; and a heating device which is arranged in the middle of a passage of the conveyance of the metal plate by the conveying device and melts the temporary-bonding material on the metal plate.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for producing (metal plate)-(ceramic board) laminated assembly wherein a bonding-material layer is formed on one of a ceramic board or a metal plate, temporary-bonding material is formed on one plate of the ceramic board or the metal plate, the ceramic board and the metal plate are temporarily stuck together in a piled state with the bonding-material layer therebetween by the temporary-bonding material, so that the ceramic board and the metal plate are laminated, the method comprising a forming step of the solidified temporary-bonding material on one plate of the ceramic board or the metal plate, and a laminating step comprising the steps of conveying the one plate onto the other plate of the ceramic board or the metal plate, melting the temporary-bonding material on the way of conveying, laminating the ceramic board and the metal plate, in a state in which the temporary-bonding material is melted, and then solidified the temporary-bonding material. 2. The method for producing (metal plate)-(ceramic board) laminated assembly according to claim 1 , wherein in the laminating step, temperature of the temporary-bonding material or the one plate is measured while conveying. 3. The method for producing (metal plate)-(ceramic board) laminated assembly according to claim 1 , wherein after laminating the metal plate and the ceramic board, the temporary-bonding material is cooled. 4. The method for producing (metal plate)-(ceramic board) laminated assembly according to claim 2 , wherein after laminating the metal plate and the ceramic board, the temporary-bonding material is cooled. 5. A method for producing power-module substrate, wherein the ceramic board and the metal plate are bonded by pressurizing in a laminating direction and heating a (metal plate)-(ceramic board) laminated assembly obtained by the method for producing (metal plate)-(ceramic board) laminated assembly according to claim 1 .
Assignees
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Classifications
Temperature monitoring · CPC title
Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title
mainly by convection · CPC title
Apparatus for thermal treatment · CPC title
for conveying, e.g. between different workstations · CPC title
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Frequently asked questions
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- What does patent US9725367B2 cover?
- Provided are: an apparatus and a method for producing a (metal plate)-(ceramic board) laminated assembly, a bonding material and a metal plate during the bonding of the metal plate to the ceramic board through the bonding-material layer and an apparatus and a method for producing a power-module substrate. An apparatus for producing a (metal plate)-(ceramic board) laminated assembly by laminatin…
- Who is the assignee on this patent?
- Mitsubishi Materials Corp
- What technology area does this patent fall under?
- Primary CPC classification C04B37/026. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Aug 08 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).