Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method

Patent metadata

Field	Value
Publication number	US-10349531-B2
Application number	US-201615209930-A
Country	US
Kind code	B2
Filing date	Jul 14, 2016
Priority date	Jul 16, 2015
Publication date	Jul 9, 2019
Grant date	Jul 9, 2019

Abstract

Provided herein is a carrier-attached copper foil having desirable laser drillability through an ultrathin copper layer, preferred for fabrication of a high-density integrated circuit substrate. The carrier-attached copper foil includes an interlayer and an ultrathin copper layer that are provided in this order on one or both surfaces of a carrier. The surface roughness Sz and the surface roughness Sa on the interlayer side of the ultrathin copper layer satisfy Sz≤3.6 μm, and Sz/Sa≤14.00 as measured with a laser microscope in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm2 and heated at 220° C. for 2 hours. GMD, which is a 60-degree glossiness of the ultrathin copper layer surface on the interlayer side in MD direction, satisfies GMD≤150 in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471 after the carrier-attached copper foil is laminated using the same procedure.

First claim

What is claimed is:

1. A carrier-attached copper foil comprising an interlayer and an ultrathin copper layer that are provided in this order on one or both surfaces of a carrier,
wherein the surface roughness Sz and the surface roughness Sa on the interlayer side of the ultrathin copper layer satisfy Sz≤3.6 μm, and Sz/Sa≤14.00 as measured with a laser microscope in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471:1995 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm 2 and heated at 220° C. for 2 hours, and
wherein GMD, which is a 60-degree glossiness of the ultrathin copper layer surface on the interlayer side in MD direction, satisfies GMD≤150 in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471:1995 after the carrier-attached copper foil is laminated using the same procedure.

2. The carrier-attached copper foil according to claim 1 , wherein the GMD, a 60-degree glossiness of the ultrathin copper layer surface on the interlayer side in MD direction, satisfies GMD≤80 in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471:1995 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm 2 and heated at 220° C. for 2 hours.

3. The carrier-attached copper foil according to claim 1 , wherein the GMD, a 60-degree glossiness of the ultrathin copper layer surface on the interlayer side in MD direction, satisfies GMD≤70 in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471:1995 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm 2 and heated at 220° C. for 2 hours.

4. The carrier-attached copper foil according to claim 1 , wherein the GMD, a 60-degree glossiness of the ultrathin copper layer surface on the interlayer side in MD direction, satisfies GMD≤65 in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471:1995 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm 2 and heated at 220° C. for 2 hours.

5. The carrier-attached copper foil according to claim 1 , wherein the GMD, a 60-degree glossiness of the ultrathin copper layer surface on the interlayer side in MD direction, satisfies GMD≤5 in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471:1995 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm 2 and heated at 220° C. for 2 hours.

6. The carrier-attached copper foil according to claim 1 , wherein the surface roughness Sz and the surface roughness Sa on the interlayer side of the ultrathin copper layer satisfy Sz/Sa≤10.50 as measured with a laser microscope in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471:1995 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm 2 and heated at 220° C. for 2 hours.

7. The carrier-attached copper foil according to claim 1 , wherein the surface roughness Sz and the surface roughness Sa on the interlayer side of the ultrathin copper layer satisfy Sz/Sa≤9.50 as measured with a laser microscope in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471:1995 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm 2 and heated at 220° C. for 2 hours.

8. The carrier-attached copper foil according to claim 1 , wherein the surface roughness Sz on the interlayer side of the ultrathin copper layer satisfies 0.01 μm≤Sz as measured with a laser microscope in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471:1995 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm 2 and heated at 220° C. for 2 hours.

9. The carrier-attached copper foil according to claim 1 , wherein the surface roughness Sz and the surface roughness Sa on the interlayer side of the ultrathin copper layer satisfy 1.00≤Sz/Sa as measured with a laser microscope in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471:1995 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm 2 and heated at 220° C. for 2 hours.

10. The carrier-attached copper foil according to claim 1 , wherein the GMD, a 60-degree glossiness of the ultrathin copper layer surface on the interlayer side in MD direction, satisfies 0.01≤GMD in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471:1995 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm 2 and heated at 220° C. for 2 hours.

11. The carrier-attached copper foil according to claim 1 , which comprises one or more layers selected from the group consisting of a roughening treatment layer, a heat-resistant layer, an antirust layer, a chromate treated layer, and a silane coupling process layer,
the one or more layers being provided on at least one of the surfaces on the side of the ultrathin copper layer and on the side of the carrier when the carrier-attached copper foil of claim 1 has the ultrathin copper layer on one surface of the carrier, and
the one or more layers being provided on one or both surfaces on the ultrathin copper layer side when the carrier-attached copper foil of claim 1 has the ultrathin copper layer on the both surfaces of the carrier.

12. The carrier-attached copper foil according to claim 1 , which comprises a resin layer on the ultrathin copper layer.

13. The carrier-attached copper foil according to claim 11 , which comprises a resin layer on the one or more layers selected from the group consisting of a roughening treatment layer, a heat-resistant layer, an antirust layer, a chromate treated layer, and a silane coupling process layer.

14. A method for producing a laminate using the carrier-attached copper foil of claim 1 .

15. A laminate comprising the carrier-attached copper foil of claim 1 , and a resin, wherein the resin covers end surfaces of the carrier-attached copper foil either in part or as a whole.

16. A laminate comprising a first carrier-attached copper foil laminated from the carrier side or the ultrathin copper layer side to the carrier side or the ultrathin copper layer side of a second carrier-attached copper foil, the first and the second carrier-attached copper foils being the carrier-attached copper foil of claim 1 .

17. The laminate according to claim 16 , wherein end surfaces of the laminate are covered with a resin either in part or as a whole.

18. A method for producing a printed wiring board, the method using a laminate produced by using the method of claim 14 .

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Miyamoto Nobuaki
• Kohiki Michiya

Classifications

• H05K3/188

  by direct electroplating · CPC title

• H05K3/4038 Primary

  Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence) · CPC title

• H05K2201/0355

  Metal foils · CPC title

• H05K3/205

  using a pattern electroplated or electroformed on a metallic carrier · CPC title

• H05K3/025 Primary

  by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper · CPC title