Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device

Patent metadata

Field	Value
Publication number	US-2017042025-A1
Application number	US-201615229197-A
Country	US
Kind code	A1
Filing date	Aug 5, 2016
Priority date	Aug 6, 2015
Publication date	Feb 9, 2017
Grant date	—

Abstract

Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum ridge height Sp as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.193 to 3.082 μm.

First claim

What is claimed is:

1 . A carrier-attached copper foil comprising a carrier, an interlayer, and an ultrathin copper layer in this order,
wherein the maximum ridge height Sp as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.193 to 3.082 μm.

2 . The carrier-attached copper foil according to claim 1 , wherein the level difference Sk of a core portion as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.097 to 0.937 μm.

3 . The carrier-attached copper foil according to claim 1 , wherein the projecting ridge height Spk as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.059 to 0.470 μm.

4 . The carrier-attached copper foil according to claim 2 , wherein the projecting ridge height Spk as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.059 to 0.470 μm.

5 . The carrier-attached copper foil according to claim 1 , wherein the actual volume Vmp of a ridge portion as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.003 to 0.024 μm 3 /μm 2 .

6 . The carrier-attached copper foil according to claim 2 , wherein the actual volume Vmp of a ridge portion as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.003 to 0.024 μm 3 /μm 2 .

7 . The carrier-attached copper foil according to claim 3 , wherein the actual volume Vmp of a ridge portion as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.003 to 0.024 μm 3 /μm 2 .

8 . The carrier-attached copper foil according to claim 4 , wherein the actual volume Vmp of a ridge portion as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.003 to 0.024 μm 3 /μm 2 .

9 . The carrier-attached copper foil according to claim 1 , wherein the ratio Sp/Spk of maximum ridge height Sp and projecting ridge height Spk as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 3.271 to 10.739.

10 . The carrier-attached copper foil according to claim 2 , wherein the ratio Sp/Spk of maximum ridge height Sp and projecting ridge height Spk as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 3.271 to 10.739.

11 . The carrier-attached copper foil according to claim 3 , wherein the ratio Sp/Spk of maximum ridge height Sp and projecting ridge height Spk as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 3.271 to 10.739.

12 . The carrier-attached copper foil according to claim 4 , wherein the ratio Sp/Spk of maximum ridge height Sp and projecting ridge height Spk as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 3.271 to 10.739.

13 . The carrier-attached copper foil according to claim 5 , wherein the ratio Sp/Spk of maximum ridge height Sp and projecting ridge height Spk as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 3.271 to 10.739.

14 . The carrier-attached copper foil according to claim 6 , wherein the ratio Sp/Spk of maximum ridge height Sp and projecting ridge height Spk as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 3.271 to 10.739.

15 . The carrier-attached copper foil according to claim 7 , wherein the ratio Sp/Spk of maximum ridge height Sp and projecting ridge height Spk as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 3.271 to 10.739.

16 . The carrier-attached copper foil according to claim 8 , wherein the ratio Sp/Spk of maximum ridge height Sp and projecting ridge height Spk as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 3.271 to 10.739.

17 . A carrier-attached copper foil comprising a carrier, an interlayer, and an ultrathin copper layer in this order,
wherein the level difference Sk of a core portion as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.097 to 0.937 μm.

18 . The carrier-attached copper foil according to claim 17 , wherein the projecting ridge height Spk as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.059 to 0.470 μm.

19 . The carrier-attached copper foil according to claim 17 , wherein the actual volume Vmp of a ridge portion as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.003 to 0.024 μm 3 /μm 2 .

20 . The carrier-attached copper foil according to claim 18 , wherein the actual volume Vmp of a ridge portion as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.003 to 0.024 μm 3 /μm 2 .

21 . The carrier-attached copper foil according to claim 17 , wherein the ratio Sp/Spk of maximum ridge height Sp and projecting ridge height Spk as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 3.271 to 10.739.

22 . The carrier-attached copper foil according to claim 18 , wherein the ratio Sp/Spk of maximum ridge height Sp and projecting ridge height Spk as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 3.271 to 10.739.

23 . The carrier-attached copper foil according to claim 19 , wherein the ratio Sp/Spk of maximum ridge height Sp and projecting ridge height Spk as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 3.271 to 10.739.

24 . The carrier-attached copper foil according to claim 20 , wherein the ratio Sp/Spk of maximum ridge height Sp and projecting ridge height Spk as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 3.271 to 10.739.

25 . A carrier-attached copper foil comprising a carrier, an interla

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Miyamoto Nobuaki

Classifications

• H05K3/025 Primary

  by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper · CPC title

• H05K3/4038

  Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence) · CPC title

• H05K3/0035

  of blind holes, i.e. having a metal layer at the bottom · CPC title

• C25D1/04

  Wires; Strips; Foils · CPC title

• H05K3/205 Primary

  using a pattern electroplated or electroformed on a metallic carrier · CPC title