Copper foil with carrier, laminate, printed wiring board, and method of producing electronic devices
US-2016381805-A1 · Dec 29, 2016 · US
using a pattern electroplated or electroformed on a metallic carrier
using a pattern electroplated or electroformed on a metallic carrier · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/205 |
| Official title | {using a pattern electroplated or electroformed on a metallic carrier} |
| Display label | using a pattern electroplated or electroformed on a metallic carrier |
| Total patents | 235 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 27 |
| 2016 | 41 |
| 2017 | 32 |
| 2018 | 29 |
| 2019 | 25 |
| 2020 | 13 |
| 2021 | 6 |
| 2022 | 19 |
| 2023 | 11 |
| 2024 | 19 |
| 2025 | 13 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Copper foil with carrier, laminate, printed wiring board, and method of producing electronic devices
US-2016381806-A1 · Dec 29, 2016 · US
Multilayer wiring board for an electronic device
US-9521755-B2 · Dec 13, 2016 · US
Carrier-Attached Copper Foil, Laminate, Printed-Wiring Board And Method For Manufacturing The Printed Wiring Board
US-2016353581-A1 · Dec 1, 2016 · US
Printed wiring board and method for manufacturing the same
US-9510447-B2 · Nov 29, 2016 · US
Printed wiring board and method for manufacturing the same
US-9510450-B2 · Nov 29, 2016 · US
Semiconductor substrate and semiconductor package structure having the same
US-2016336287-A1 · Nov 17, 2016 · US
Printed wiring board and method for manufacturing the same
US-2016316558-A1 · Oct 27, 2016 · US
Interposer substrate, semiconductor structure and fabricating process thereof
US-9478500-B2 · Oct 25, 2016 · US
Copper etching method for manufacturing circuit board
US-2016262269-A1 · Sep 8, 2016 · US
Semiconductor substrate and semiconductor package structure having the same
US-9437565-B2 · Sep 6, 2016 · US
Interposer substrate, semiconductor structure and fabricating process thereof
US-2016240481-A1 · Aug 18, 2016 · US
Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
US-2016234935-A1 · Aug 11, 2016 · US
Chip package, package substrate and manufacturing method thereof
US-2016219714-A1 · Jul 28, 2016 · US
Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board
US-2016212846-A1 · Jul 21, 2016 · US
Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
US-2016212857-A1 · Jul 21, 2016 · US
Semiconductor substrate and semiconductor package structure having the same
US-2016190079-A1 · Jun 30, 2016 · US
Method of manufacturing wiring substrate
US-9380707-B2 · Jun 28, 2016 · US
Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
US-2016157356-A1 · Jun 2, 2016 · US
Method of fabricating a wiring board
US-9345143-B2 · May 17, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/205?
- CPC H05K3/205 is the Cooperative Patent Classification code for “using a pattern electroplated or electroformed on a metallic carrier.”
- How many patents are filed under CPC H05K3/205 (using a pattern electroplated or electroformed on a metallic carrier)?
- Our database includes 235 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/205 growing?
- Publication counts under this code: 19 in 2024 vs 13 in 2025 (latest complete years).