Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Printed-Wiring Board And Method For Manufacturing Electronic Device

Patent metadata

Field	Value
Publication number	US-2017034926-A1
Application number	US-201615218449-A
Country	US
Kind code	A1
Filing date	Jul 25, 2016
Priority date	Jul 27, 2015
Publication date	Feb 2, 2017
Grant date	—

Abstract

A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the number of crystal grains per unit cross-sectional area of the ultra-thin copper layer in the through-thickness direction is 0.1 to 5 grains/μm 2 , and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 μm.

First claim

1 . A carrier-attached copper foil having a carrier, an intermediate layer and an ultra-thin copper layer in this order,
wherein a number of crystal grains per unit cross-sectional area of the ultra-thin copper layer in a through-thickness direction is 0.1 to 5 grains/μm 2 , and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 μm.

2 . The carrier-attached copper foil according to claim 1 , wherein the ten point average roughness Rz of the surface on the side of the ultra-thin copper layer is 0.11 to 1.9 μm.

3 . The carrier-attached copper foil according to claim 2 , wherein the ten point average roughness Rz of the surface on the side of the ultra-thin copper layer is 0.12 to 1.8 μm.

4 . The carrier-attached copper foil according to claim 1 , wherein the number of crystal grains per unit cross-sectional area of the ultra-thin copper layer in the through-thickness direction is 0.2 to 4.8 grains/μm 2 .

5 . The carrier-attached copper foil according to claim 4 , wherein the number of crystal grains per unit cross-sectional area of the ultra-thin copper layer in the through-thickness direction is 0.3 to 4.5 grains/μm 2 .

6 . The carrier-attached copper foil according to claim 1 , wherein the number of crystal grains per unit cross-sectional area of the ultra-thin copper layer in the through-thickness direction is 1.15 grains/μm 2 or less.

7 . The carrier-attached copper foil according to claim 1 , wherein the average grain size of crystal grains that form the ultra-thin copper layer is 0.5 to 6.0 μm in the cross section taken in the direction parallel to the through-thickness direction of the ultra-thin copper layer.

8 . The carrier-attached copper foil according to claim 7 , wherein the average grain size of crystal grains that form the ultra-thin copper layer is 0.6 to 5.8 μm in the cross section taken in the direction parallel to the through-thickness direction of the ultra-thin copper layer.

9 . The carrier-attached copper foil according to claim 8 , wherein the average grain size of crystal grains that form the ultra-thin copper layer is 0.7 to 5.6 μm in the cross section taken in the direction parallel to the through-thickness direction of the ultra-thin copper layer.

10 . The carrier-attached copper foil according to claim 9 , wherein the average grain size of crystal grains that form the ultra-thin copper layer is 1.0 to 5.6 μm in the cross section taken in the direction parallel to the through-thickness direction of the ultra-thin copper layer.

11 . The carrier-attached copper foil according to claim 1 , wherein the carrier-attached copper foil is used for manufacturing a coreless printed wiring board.

12 . The carrier-attached copper foil according to claim 1 , wherein the carrier-attached copper foil has at least one layer selected from a group of a roughened layer, a heat-resistant layer, a rustproofing layer, a chromate treated layer, and a silane coupling-treated layer, and
when the carrier-attached copper foil according to claim 1 has the ultra-thin copper layer on one face of the carrier, the at least one layer is on at least one or both of a surface on a side of the ultra-thin copper layer and a surface on a side of the carrier, or when the carrier-attached copper foil according to claim 1 has the ultra-thin copper layer on each of both faces of the carrier, the at least one layer is on one or both of surfaces on sides of the ultra-thin copper layer.

13 . The carrier-attached copper foil according to claim 12 , wherein the roughened layer is a layer of an alloy including any one or at least one selected from a group consisting of copper, nickel, phosphorus, tungsten, arsenic, molybdenum, chromium, titanium, iron, vanadium, cobalt, and zinc.

14 . The carrier-attached copper foil according to claim 12 , wherein the carrier-attached copper foil has a resin layer on the at least one layer selected from the group of the roughened layer, the heat-resistant layer, the rustproofing layer, the chromate treated layer, and the silane coupling-treated layer.

15 . The carrier-attached copper foil according to claim 1 , wherein a resin layer is provided on the ultra-thin copper layer.

16 . A laminate comprising the carrier-attached copper foil according to claim 1 .

17 . A laminate comprising the carrier-attached copper foil according to claim 1 and a resin,
wherein a portion or all of edge faces of the carrier-attached copper foil is covered with the resin.

18 . A laminate comprising two carrier-attached copper foils according to claim 1 and a resin,
wherein the two carrier-attached copper foils are provided on the resin so that a surface on a side of the ultra-thin copper layer of one carrier-attached copper foil of the two carrier-attached copper foils and a surface on a side of the ultra-thin copper layer of another carrier-attached copper foil are exposed.

19 . A laminate wherein the carrier-attached copper foil according to claim 1 is laminated from a side of the carrier or a side of the ultra-thin copper layer on a side of the carrier or a side of the ultra-thin copper layer of another carrier-attached copper foil according to claim 1 .

20 . A printed wiring board manufacturing method of manufacturing a printed wiring board by using the carrier-attached copper foil according to claim 1 .

21 . A method of manufacturing a printed wiring board comprising:
preparing the carrier-attached copper foil according to claim 1 and an insulating substrate; laminating the carrier-attached copper foil and the insulating substrate; detaching the carrier from the carrier-attached copper foil after the carrier-attached copper foil and the insulating substrate are laminated to form a copper-clad laminate; and forming a circuit by any one of a semi-additive method, a subtractive method, a partly additive method, and a modified semi-additive method.

22 . A method of manufacturing a printed wiring board comprising:
forming a circuit on a surface on a side of the ultra-thin copper layer or a surface on a side of the carrier of the carrier-attached copper foil according to claim 1 ; forming a resin layer on the surface on the side of the ultra-thin copper layer or the surface on the side of the carrier of the carrier-attached copper foil so that the circuit is buried; detaching the carrier or the ultra-thin copper layer after forming the resin layer; and exposing, after detaching the carrier or the ultra-thin copper layer, the circuit that is formed on the surface on the side of the ultra-thin copper layer or the surface on the side of the carrier and is buried in the resin layer by removing the carrier or the ultra-thin copper layer.

23 . A method of manufacturing a printed wiring board comprising:
laminating the carrier-attached copper foil according to claim 1 on a resin substrate so as to attach a side of the carrier to the resin substrate; forming a circuit on the surface on the side of the ultra-thin copper layer of the carrier-attached copper foil; forming a resin layer on the surface on the side of the ultra-thin copper layer of the carrier-attached copper foil so that the circuit is buried; detaching the carrier after forming the resin layer; and exposing, after detaching the carrier, the circuit that is formed on the surface on the side of the ultra-thin copper layer and is buried in the resin layer by removing the ultra-thin copper layer.

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Moriyama Terumasa
• Nagaura Tomota

Classifications

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• H05K3/007

  Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K1/187, H05K3/20 and H05K3/4682 take precedence) · CPC title

• H05K3/025 Primary

  by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper · CPC title

• Y10T428/12431

  Foil or filament smaller than 6 mils · CPC title

• B32B15/08

  of synthetic resin · CPC title