Surface treated copper foil, copper clad laminate, and printed circuit board
US-11382217-B2 · Jul 5, 2022 · US
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Miyamoto Nobuaki patents
Miyamoto Nobuaki is listed as an inventor on 19 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Miyamoto Nobuaki |
| Total patents | 19 |
| First publication | Jun 23, 2016 |
| Latest publication | Jul 5, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Surface treated copper foil, copper clad laminate, and printed circuit board
US-11375624-B2 · Jun 28, 2022 · US
Surface treated copper foil, copper clad laminate, and printed circuit board
US-11337314-B2 · May 17, 2022 · US
Surface treated copper foil, copper clad laminate, and printed circuit board
US-11337315-B2 · May 17, 2022 · US
Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circuit Board
US-2021362475-A1 · Nov 25, 2021 · US
Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circuit Board
US-2021360785-A1 · Nov 18, 2021 · US
Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circuit Board
US-2021331449-A1 · Oct 28, 2021 · US
Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circuit Board
US-2021337664-A1 · Oct 28, 2021 · US
Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device
US-10356898-B2 · Jul 16, 2019 · US
Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method
US-10349531-B2 · Jul 9, 2019 · US
Recent patents
Latest publications not already listed above.
Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device
US-10299385-B2 · May 21, 2019 · US
Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device
US-10251283-B2 · Apr 2, 2019 · US
Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
US-2018279482-A1 · Sep 27, 2018 · US
Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
US-9955583-B2 · Apr 24, 2018 · US
Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device
US-2017042025-A1 · Feb 9, 2017 · US
Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device
US-2017042044-A1 · Feb 9, 2017 · US
Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device
US-2017042036-A1 · Feb 9, 2017 · US
Carrier-Attached Copper Foil, Laminate, Laminate Producing Method, Printed Wiring Board Producing Method, And Electronic Device Producing Method
US-2017019991-A1 · Jan 19, 2017 · US
Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
US-2016183380-A1 · Jun 23, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Jx Nippon Mining & Metals Corp | 19 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B32B2457/08 | 19 |
| H05K1/09 | 19 |
| H05K2201/0355 | 19 |
| B32B15/20 | 19 |
| C25D7/0614 | 17 |