Method of manufacturing printed circuit board
US-2024414849-A1 · Dec 12, 2024 · US
by direct electroplating
by direct electroplating · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/188 |
| Official title | {by direct electroplating} |
| Display label | by direct electroplating |
| Total patents | 534 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 36 |
| 2016 | 59 |
| 2017 | 50 |
| 2018 | 51 |
| 2019 | 57 |
| 2020 | 49 |
| 2021 | 39 |
| 2022 | 48 |
| 2023 | 39 |
| 2024 | 62 |
| 2025 | 38 |
| 2026 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electronic component package and method for manufacturing electronic component package
US-2024090133-A1 · Mar 14, 2024 · US
Printed circuit board and method of manufacturing the same
US-2016374197-A1 · Dec 22, 2016 · US
Circuit board, method for making the same, and portable electronic device employing the same
US-2016366766-A1 · Dec 15, 2016 · US
Transparent conductive films with embedded metal grids
US-2016345430-A1 · Nov 24, 2016 · US
Method of forming conductive traces on insulated substrate
US-9504165-B2 · Nov 22, 2016 · US
Integration of embedded thin film capacitors in package substrates
US-2016329153-A1 · Nov 10, 2016 · US
Flexible circuit board and method for manufacturing same
US-9485859-B1 · Nov 1, 2016 · US
Copper etching method for manufacturing circuit board
US-2016262269-A1 · Sep 8, 2016 · US
Biocompatible Bonding Method and Electronics Package Suitable for Implantation
US-2016255720-A1 · Sep 1, 2016 · US
Copper foil with carrier
US-2016242281-A1 · Aug 18, 2016 · US
Reaction products of guanidine compounds or salts thereof, polyepoxides and polyhalogens
US-9404193-B1 · Aug 2, 2016 · US
Reaction products of guanidine compounds or salts thereof, polyepoxides and polyhalogens
US-9403762-B2 · Aug 2, 2016 · US
Reaction products of guanidine compounds or salts thereof, polyepoxides and polyhalogens
US-2016208400-A1 · Jul 21, 2016 · US
Electric conductive heat dissipation substrate
US-9397279-B2 · Jul 19, 2016 · US
Sulfonamide based polymers for copper electroplating
US-2016186345-A1 · Jun 30, 2016 · US
Reaction products of heterocyclic nitrogen compounds polyepoxides and polyhalogens
US-2016143152-A1 · May 19, 2016 · US
Submount and manufacturing method thereof and semiconductor laser device and manufacturing method thereof
US-2016118767-A1 · Apr 28, 2016 · US
Electrode structure
US-9320142-B2 · Apr 19, 2016 · US
Plating method
US-2016097141-A1 · Apr 7, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/188?
- CPC H05K3/188 is the Cooperative Patent Classification code for “by direct electroplating.”
- How many patents are filed under CPC H05K3/188 (by direct electroplating)?
- Our database includes 534 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/188 growing?
- Publication counts under this code: 62 in 2024 vs 38 in 2025 (latest complete years).