Negative electrode current collector for secondary battery
US-2020036010-A1 · Jan 30, 2020 · US
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Kohiki Michiya patents
Kohiki Michiya is listed as an inventor on 23 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kohiki Michiya |
| Total patents | 23 |
| First publication | Feb 19, 2015 |
| Latest publication | Jan 30, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method
US-10349531-B2 · Jul 9, 2019 · US
Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
US-10257938-B2 · Apr 9, 2019 · US
Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board
US-10187983-B2 · Jan 22, 2019 · US
Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
US-10178775-B2 · Jan 8, 2019 · US
Ultrathin copper foil and method of manufacturing the same, and ultrathin copper layer
US-9930776-B2 · Mar 27, 2018 · US
Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
US-2018063950-A1 · Mar 1, 2018 · US
Copper foil with release layer, laminated material, method for producing printed wiring board, and method for producing electronic apparatus
US-2017362733-A1 · Dec 21, 2017 · US
Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
US-9839124-B2 · Dec 5, 2017 · US
Copper foil with carrier
US-9788423-B2 · Oct 10, 2017 · US
Recent patents
Latest publications not already listed above.
Copper foil with carrier, method of producing same, copper foil with carrier for printed wiring board, and printed wiring board
US-9578741-B2 · Feb 21, 2017 · US
Carrier-Attached Copper Foil, Laminate, Laminate Producing Method, Printed Wiring Board Producing Method, And Electronic Device Producing Method
US-2017019991-A1 · Jan 19, 2017 · US
Copper foil with carrier, laminate, printed wiring board, and method of producing electronic devices
US-2016381805-A1 · Dec 29, 2016 · US
Copper foil with carrier, laminate, printed wiring board, and method of producing electronic devices
US-2016381806-A1 · Dec 29, 2016 · US
Copper foil with carrier, laminate, method of producing printed wiring board, and method of producing electronic devices
US-2016374205-A1 · Dec 22, 2016 · US
Copper foil with carrier
US-2016242281-A1 · Aug 18, 2016 · US
Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
US-2016234935-A1 · Aug 11, 2016 · US
Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board
US-2016212846-A1 · Jul 21, 2016 · US
Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
US-2016212857-A1 · Jul 21, 2016 · US
Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
US-2016157356-A1 · Jun 2, 2016 · US
Ultrathin Copper Foil And Method Of Manufacturing The Same, And Ultrathin Copper Layer
US-2015195909-A1 · Jul 9, 2015 · US
Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board and printed wiring board
US-9028972-B2 · May 12, 2015 · US
Copper Foil with Carrier, Method of Producing Same, Copper Foil with Carrier for Printed Wiring Board, and Printed Wiring Board
US-2015047884-A1 · Feb 19, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Jx Nippon Mining & Metals Corp | 23 |
| Kohiki Michiya | 1 |
| Moriyama Terumasa | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K1/09 | 22 |
| H05K3/025 | 21 |
| H05K2201/0355 | 20 |
| C25D1/04 | 17 |
| C25D3/38 | 17 |