Multi version library cell handling and integrated circuit structures fabricated therefrom
US-2025225306-A1 · Jul 10, 2025 · US
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Yeoh Andrew W patents
Yeoh Andrew W is listed as an inventor on 49 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yeoh Andrew W |
| Total patents | 49 |
| First publication | Sep 8, 2015 |
| Latest publication | Jul 10, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Plugs for interconnect lines for advanced integrated circuit structure fabrication
US-2025098258-A1 · Mar 20, 2025 · US
Heterogeneous metal line compositions for advanced integrated circuit structure fabrication
US-2025072078-A1 · Feb 27, 2025 · US
Contact over active gate structures for advanced integrated circuit structure fabrication
US-2025022939-A1 · Jan 16, 2025 · US
Plugs for interconnect lines for advanced integrated circuit structure fabrication
US-12199168-B2 · Jan 14, 2025 · US
Contact over active gate structures for advanced integrated circuit structure fabrication
US-12142667-B2 · Nov 12, 2024 · US
Multi version library cell handling and integrated circuit structures fabricated therefrom
US-2024362391-A1 · Oct 31, 2024 · US
Multi version library cell handling and integrated circuit structures fabricated therefrom
US-12067338-B2 · Aug 20, 2024 · US
Heterogeneous metal line compositions for advanced integrated circuit structure fabrication
US-11955534-B2 · Apr 9, 2024 · US
Heterogeneous metal line compositions for advanced integrated circuit structure fabrication
US-2024047556-A1 · Feb 8, 2024 · US
Recent patents
Latest publications not already listed above.
Contact over active gate structures for advanced integrated circuit structure fabrication
US-2023144607-A1 · May 11, 2023 · US
Heterogeneous metal line compositions for advanced integrated circuit structure fabrication
US-2023101723-A1 · Mar 30, 2023 · US
Heterogeneous metal line compositions for advanced integrated circuit structure fabrication
US-11581419-B2 · Feb 14, 2023 · US
Plugs for interconnect lines for advanced integrated circuit structure fabrication
US-2022336633-A1 · Oct 20, 2022 · US
Plugs for interconnect lines for advanced integrated circuit structure fabrication
US-11404559-B2 · Aug 2, 2022 · US
Multi version library cell handling and integrated circuit structures fabricated therefrom
US-2022149075-A1 · May 12, 2022 · US
Multi version library cell handling and integrated circuit structures fabricated therefrom
US-11271010-B2 · Mar 8, 2022 · US
Contact over active gate structures for advanced integrated circuit structure fabrication
US-2021234022-A1 · Jul 29, 2021 · US
Contact over active gate structures for advanced integrated circuit structure fabrication
US-11031487-B2 · Jun 8, 2021 · US
Etch-stop layer topography for advanced integrated circuit structure fabrication
US-10943817-B2 · Mar 9, 2021 · US
Heterogeneous metal line compositions for advanced integrated circuit structure fabrication
US-2021066475-A1 · Mar 4, 2021 · US
Plugs for interconnect lines for advanced integrated circuit structure fabrication
US-2021013323-A1 · Jan 14, 2021 · US
Heterogeneous metal line compositions for advanced integrated circuit structure fabrication
US-10854731-B2 · Dec 1, 2020 · US
Multi version library cell handling and integrated circuit structures fabricated therefrom
US-2020357823-A1 · Nov 12, 2020 · US
Plugs for interconnect lines for advanced integrated circuit structure fabrication
US-10818774-B2 · Oct 27, 2020 · US
Etch-stop layer topography for advanced integrated circuit structure fabrication
US-10796951-B2 · Oct 6, 2020 · US
Heterogeneous metal line compositions for advanced integrated circuit structure fabrication
US-10777655-B2 · Sep 15, 2020 · US
Contact over active gate structures for advanced integrated circuit structure fabrication
US-2020105906-A1 · Apr 2, 2020 · US
Heterogeneous metal line compositions for advanced integrated circuit structure fabrication
US-2020044049-A1 · Feb 6, 2020 · US
Pitch-divided interconnects for advanced integrated circuit structure fabrication
US-2020043850-A1 · Feb 6, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 49 |
| Bohr Mark T | 3 |
| Yeoh Andrew W | 3 |
| Lee Kevin J | 2 |
| Pelto Christopher M | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D84/853 | 37 |
| H10D84/0193 | 37 |
| H10D84/0186 | 37 |
| H10D84/038 | 37 |
| H10W20/42 | 35 |