Through-body via formation techniques
US-2017011987-A1 · Jan 12, 2017 · US
This page is not indexed by search engines while we improve data quality.
Lee Kevin J patents
Lee Kevin J holds 6 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 6 |
| Recent patents | 0 |
| First publication | Jan 13, 2015 |
| Latest publication | Jan 12, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Masking content while preserving layout of a webpage
US-9489354-B1 · Nov 8, 2016 · US
3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias
US-9449913-B2 · Sep 20, 2016 · US
3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach
US-9142510-B2 · Sep 22, 2015 · US
Structure having a planar bonding surface
US-8994174-B2 · Mar 31, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Through-body via formation techniques
US-2017011987-A1 · Jan 12, 2017 · US
Masking content while preserving layout of a webpage
US-9489354-B1 · Nov 8, 2016 · US
3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias
US-9449913-B2 · Sep 20, 2016 · US
3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach
US-9142510-B2 · Sep 22, 2015 · US
Structure having a planar bonding surface
US-8994174-B2 · Mar 31, 2015 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 5 |
| Physics | 1 |