Semiconductor structure and method for forming the same
US-12599011-B2 · Apr 7, 2026 · US
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Wang Wei-Ming patents
Wang Wei-Ming is listed as an inventor on 64 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Wei-Ming |
| Total patents | 64 |
| First publication | Aug 29, 2019 |
| Latest publication | Apr 7, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Photonic assembly for enhanced bonding yield and methods for forming the same
US-12554064-B2 · Feb 17, 2026 · US
Adding sealing material to wafer edge for wafer bonding
US-12543604-B2 · Feb 3, 2026 · US
Semiconductor processing tool and methods of operation
US-12505987-B2 · Dec 23, 2025 · US
Bonded structure with half-oval bonding pad pair design and method of forming the same
US-2025372552-A1 · Dec 4, 2025 · US
Semiconductor processing tool and methods of operation
US-2025364222-A1 · Nov 27, 2025 · US
Semiconductor device
US-2025357235-A1 · Nov 20, 2025 · US
Semiconductor structure having through substrate via and manufacturing method thereof
US-2025329616-A1 · Oct 23, 2025 · US
Semiconductor package and manufacturing method thereof
US-12374596-B2 · Jul 29, 2025 · US
Semiconductor structure having through substrate via and manufacturing method thereof
US-12374602-B2 · Jul 29, 2025 · US
Recent patents
Latest publications not already listed above.
Thermal Structure for Semiconductor Device and Method of Forming the Same
US-2025201649-A1 · Jun 19, 2025 · US
Semiconductor structure having optical component and manufacturing method thereof
US-2025174586-A1 · May 29, 2025 · US
Auto detection system for cooking assistance
US-2025155134-A1 · May 15, 2025 · US
Photonic assembly for enhanced bonding yield and methods for forming the same
US-2025149477-A1 · May 8, 2025 · US
Semiconductor package and method of fabricating the same
US-2025118612-A1 · Apr 10, 2025 · US
Thermal structure for semiconductor device and method of forming the same
US-12272613-B2 · Apr 8, 2025 · US
System and method for particle control in mram processing
US-2025095975-A1 · Mar 20, 2025 · US
Auto detection system for cooking assistance and hair dryer with thermal detection
US-12215872-B2 · Feb 4, 2025 · US
Photonic package and method for forming the same
US-2025004202-A1 · Jan 2, 2025 · US
System and method for particle control in MRAM processing
US-12176192-B2 · Dec 24, 2024 · US
Semiconductor processing tool and methods of operation
US-2024384403-A1 · Nov 21, 2024 · US
Resistive random access memory device
US-12096706-B2 · Sep 17, 2024 · US
Semiconductor processing tool and methods of operation
US-12084762-B2 · Sep 10, 2024 · US
Semiconductor memory device having composite dielectric film structure and methods of forming the same
US-2024290672-A1 · Aug 29, 2024 · US
Methods for reducing vibration of semiconductor manufacturing apparatuses and semiconductor manufacturing apparatuses
US-2024247700-A1 · Jul 25, 2024 · US
Semiconductor memory device having composite dielectric film structure and methods of forming the same
US-12014966-B2 · Jun 18, 2024 · US
Systems and methods for reducing vibration of apparatuses
US-12000455-B2 · Jun 4, 2024 · US
Methods of Integrated Chip of Ultra-Fine Pitch Bonding and Resulting Structures
US-2024153901-A1 · May 9, 2024 · US
Semiconductor structure and method for forming the same
US-2024128178-A1 · Apr 18, 2024 · US
Methods for forming semiconductor package
US-2024113034-A1 · Apr 4, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 56 |
| Pixart Imaging Inc | 7 |
| Taiwan Semiconductor Mfg Company Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 23 |
| H10W90/792 | 15 |
| H10W90/297 | 14 |
| H01L24/08 | 14 |
| H10W80/327 | 13 |