Semiconductor package
US-2024404970-A1 · Dec 5, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L24/08 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 6,836 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 43 |
| 2016 | 85 |
| 2017 | 121 |
| 2018 | 135 |
| 2019 | 217 |
| 2020 | 416 |
| 2021 | 585 |
| 2022 | 734 |
| 2023 | 981 |
| 2024 | 1,373 |
| 2025 | 1,778 |
| 2026 | 368 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device manufacturing method and semiconductor device manufactured using the same
US-2024395745-A1 · Nov 28, 2024 · US
Semiconductor device and method of manufacturing same
US-2024395697-A1 · Nov 28, 2024 · US
Semiconductor memory device and manufacturing method of semiconductor memory device
US-12144179-B2 · Nov 12, 2024 · US
Semiconductor packages
US-2024363472-A1 · Oct 31, 2024 · US
Microelectronic assemblies with inductors in direct bonding regions
US-2024355768-A1 · Oct 24, 2024 · US
Apparatus and method for making a secured substrate
US-2024355722-A1 · Oct 24, 2024 · US
Semiconductor memory device
US-2024315058-A1 · Sep 19, 2024 · US
Package substrate having porous dielectric layer
US-2024282693-A1 · Aug 22, 2024 · US
Conductive barrier direct hybrid bonding
US-2024243085-A1 · Jul 18, 2024 · US
Memory stack structure including power distribution structures and a high-bandwidth memory including the memory stack structure
US-2024213219-A1 · Jun 27, 2024 · US
Semiconductor packages and methods for fabricating the same
US-2024203855-A1 · Jun 20, 2024 · US
Chip package structure and method for preparing chip package structure
US-2024178167-A1 · May 30, 2024 · US
Apparatus for non-volatile random access memory stacks
US-2024145438-A1 · May 2, 2024 · US
Memory system, semiconductor device and fabrication method therefor
US-2024107759-A1 · Mar 28, 2024 · US
Semiconductor storage device
US-2024107765-A1 · Mar 28, 2024 · US
Stacked semiconductor method and apparatus
US-2024096745-A1 · Mar 21, 2024 · US
Tightly-coupled random access memory interface shim die
US-2024088084-A1 · Mar 14, 2024 · US
Semiconductor package and manufacturing method thereof
US-2024063160-A1 · Feb 22, 2024 · US
Non-volatile memory device
US-2024055469-A1 · Feb 15, 2024 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L24/08?
- CPC H01L24/08 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L24/08 (Electricity)?
- Our database includes 6,836 publications tagged with this CPC code.
- Is patent activity under CPC H01L24/08 growing?
- Publication counts under this code: 1,373 in 2024 vs 1,778 in 2025 (latest complete years).