Semiconductor processing tool and methods of operation

Patent metadata

Field	Value
Publication number	US-12505987-B2
Application number	US-202217660169-A
Country	US
Kind code	B2
Filing date	Apr 21, 2022
Priority date	Apr 21, 2022
Publication date	Dec 23, 2025
Grant date	Dec 23, 2025

Abstract

Some implementations described herein provide techniques and apparatuses for overcoming forces that may deflect an injector nozzle into an interior wall of a thin-film furnace. The implementations include a fixture that is coupled to the injector nozzle. The fixture is configurable to lock to a selected property of the injector nozzle to maintain, between a portion of the injector nozzle and the interior wall, a gap. In this way, the portion of the injector nozzle is prevented from colliding with the interior wall and dislodging particulates that may contaminate semiconductor product fabricated using the thin-film furnace.

First claim

What is claimed is:

1 . A method, comprising:
transmitting, by a controller to a gas source of a gas distribution system, a signal to initiate a flow of a gas into a processing chamber of a deposition tool,
wherein the gas distribution system provides the flow of the gas through a gas inlet passing through an interior wall of the processing chamber and through an injector nozzle that is elongated parallel to the interior wall,
wherein a fixture is configured to overcome one or more forces that deflect the injector nozzle towards the interior wall,
wherein the fixture is configured to lock at a dimension of the injector nozzle to maintain, between the injector nozzle and the interior wall, a gap to prevent the injector nozzle from colliding with the interior wall and dislodging particulates, and
wherein the fixture comprises:
a portion that engages with the injector nozzle; and
a locking component configured to lock the portion at the dimension of the injector nozzle; and

transmitting, by the controller to the gas source, another signal to stop the flow of the gas into the processing chamber.

2 . The method of claim 1 , wherein the fixture is coupled to an end portion of the injector nozzle,
wherein the fixture is configured to overcome the one or more forces that deflect the end portion of the injector nozzle towards the interior wall; wherein the dimension is of the end portion and the locking component is configured to lock to maintain, between the end portion and the interior wall, a gap to prevent the end portion from colliding with the interior wall and dislodging particulates; and wherein the dimension is a diameter of a cross-section of the end portion of the injector nozzle.

3 . The method of claim 1 , wherein the gap is in a range of approximately 0.5 centimeters to approximately 1.0 centimeters.

4 . The method of claim 1 , wherein at least one of the one or more forces corresponds to one or more exhaust forces from the flow of the gas through one or more exhaust ports of the injector nozzle.

5 . The method of claim 1 , wherein at least one of the one or more forces corresponds to a vibration force from within the deposition tool.

6 . The method of claim 1 , wherein the portion that engages with the injector nozzle comprises:
a first blade region comprising a first cavity; and a second blade region comprising a second cavity.

7 . The method of claim 1 , wherein the locking component comprises:
a capture pin; and one or more crenulations configured to receive the capture pin.

8 . A method, comprising:
providing a flow of a gas, into a processing chamber of a deposition tool, via a gas inlet that passes through an interior wall of the processing chamber and through an injector nozzle, coupled to a fixture via an end portion of the injector nozzle, that extends along a direction of the interior wall, wherein the flow of gas is provided based on:
the fixture overcoming a force that deflects the end portion towards the interior wall; and
the fixture locking at a dimension of the end portion to maintain a gap between the injector nozzle and the interior wall, and
wherein the fixture comprises:
a first blade region comprising a first cavity having a first shape; and
a second blade region comprising a second cavity having a second shape.

9 . The method of claim 8 , wherein the dimension is a diameter of a cross-section of the end portion of the injector nozzle.

10 . The method of claim 8 , wherein the injector nozzle comprises a plurality of exhaust ports, arranged in a linear array, configured to provide the flow of the gas received into the processing chamber.

11 . The method of claim 10 , wherein the plurality of exhaust ports comprises at least one exhaust port facing away from the interior wall and towards a semiconductor substrate located within the processing chamber.

12 . The method of claim 8 , wherein the force corresponds to an exhaust force from the flow of the gas or a vibration force from within the deposition tool.

13 . The method of claim 8 , further comprising:
transmitting, by a controller, a signal to initiate the flow of the gas into the processing chamber; and transmitting, by the controller, another signal to stop the flow of the gas.

14 . The method of claim 8 , wherein the injector nozzle extends approximately parallel to the interior wall.

15 . The method of claim 8 , wherein the fixture further comprises:
a locking component configured to lock a distance from a first apex of the first cavity to a second apex of the second cavity.

16 . The method of claim 15 , wherein the locking component comprises:
a capture pin; and one or more crenulations configured to receive the capture pin.

17 . A method, comprising:
providing a flow of a gas through an injector nozzle of a processing chamber of a deposition tool,
wherein the injector nozzle extends along a direction of an interior wall of the processing chamber,
wherein the injector nozzle is coupled to a fixture,
wherein the fixture is configured to overcome one or more forces that deflect the injector nozzle towards the interior wall, and
wherein the fixture comprises:
a first arm comprising a first cavity;
a second arm comprising a second cavity opposing the first cavity; and
a locking component configured to fix a distance between the first cavity and the second cavity.

18 . The method of claim 17 , further comprising clamping a portion of the injector nozzle between the first cavity and the second cavity to couple the injector nozzle to the fixture.

19 . The method of claim 17 , wherein the locking component comprises:
a capture pin; and one or more crenulations configured to receive the capture pin.

20 . The method of claim 17 , wherein the distance is from a first apex of the first cavity to a second apex of the second cavity.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Ho Yi Chen
• Liao Chih Ping
• Yang Shih Hao
• Wang Wei-Ming
• Lin Chien Ting
• Yang Jie-Ying
• Tang Chih-Che
• Teng Kuo Kang
• Yu Ming-Hui
• Liao Ker-Hsun
• Lin Chi-Hsun

Classifications

• C23C16/52

  Controlling or regulating the coating process {(C23C16/45557, C23C16/279 take precedence)} · CPC title

• C23C16/45591

  Fixed means, e.g. wings, baffles · CPC title

• H01J2237/3321

  CVD [Chemical Vapor Deposition] · CPC title

• C23C16/45578

  Elongated nozzles, tubes with holes · CPC title

• H01J37/32449 Primary

  Gas control, e.g. control of the gas flow · CPC title