Method of fabricating semiconductor package structure
US-10141266-B2 · Nov 27, 2018 · US
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Sun Ming-Chen patents
Sun Ming-Chen is listed as an inventor on 32 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sun Ming-Chen |
| Total patents | 32 |
| First publication | Apr 16, 2015 |
| Latest publication | Nov 27, 2018 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of fabricating a packaging substrate including a carrier having two carrying portions
US-10096491-B2 · Oct 9, 2018 · US
Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same
US-10068842-B2 · Sep 4, 2018 · US
Method of fabricating semiconductor package
US-2018247891-A1 · Aug 30, 2018 · US
Semiconductor package structure and method of fabricating the same
US-10043757-B2 · Aug 7, 2018 · US
Method of fabricating package structure with an embedded electronic component
US-10002825-B2 · Jun 19, 2018 · US
Method of fabricating package structure with an embedded electronic component
US-2017352615-A1 · Dec 7, 2017 · US
Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same
US-2017309537-A1 · Oct 26, 2017 · US
Fabrication method of package structure
US-2017301658-A1 · Oct 19, 2017 · US
Semiconductor package structure and method of fabricating the same
US-2017287840-A1 · Oct 5, 2017 · US
Recent patents
Latest publications not already listed above.
Method of manufacturing package substrate and semiconductor package
US-2017236725-A1 · Aug 17, 2017 · US
Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same
US-9735080-B2 · Aug 15, 2017 · US
Package structure with an embedded electronic component and method of fabricating the package structure
US-9716060-B2 · Jul 25, 2017 · US
Package structure having a laminated release layer and method for fabricating the same
US-9673140-B2 · Jun 6, 2017 · US
Package substrate, semiconductor package and method of manufacturing the same
US-9640503-B2 · May 2, 2017 · US
Fabrication method of coreless packaging substrate
US-2017047240-A1 · Feb 16, 2017 · US
Coreless packaging substrate and fabrication method thereof
US-9510463-B2 · Nov 29, 2016 · US
Package structure and fabrication method thereof
US-9490225-B2 · Nov 8, 2016 · US
Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same
US-2016163621-A1 · Jun 9, 2016 · US
Package substrate, semiconductor package and method of manufacturing the same
US-2016155716-A1 · Jun 2, 2016 · US
Package substrate and method of fabricating the same
US-2016086879-A1 · Mar 24, 2016 · US
Semiconductor package structure and method of fabricating the same
US-2016079170-A1 · Mar 17, 2016 · US
Package structure with an embedded electronic component and method of fabricating the package structure
US-2016079151-A1 · Mar 17, 2016 · US
Semiconductor package and method of fabricating the same
US-2016071780-A1 · Mar 10, 2016 · US
Coreless packaging substrate and fabrication method thereof
US-2016021743-A1 · Jan 21, 2016 · US
Package structure and fabrication method thereof
US-2016013123-A1 · Jan 14, 2016 · US
Package structure and fabrication method thereof
US-2015348929-A1 · Dec 3, 2015 · US
Package substrate and method for fabricating the same
US-2015333029-A1 · Nov 19, 2015 · US
Coreless packaging substrate, pop structure, and methods for fabricating the same
US-2015325516-A1 · Nov 12, 2015 · US
Method of fabricating a packaging substrate
US-2015303073-A1 · Oct 22, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Siliconware Precision Industries Co Ltd | 32 |
| Silicon Prec Industries Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 24 |
| H10W70/635 | 21 |
| H10W90/701 | 18 |
| H10W70/614 | 16 |
| H10W74/15 | 15 |