Package structure with an embedded electronic component and method of fabricating the package structure

Patent metadata

Field	Value
Publication number	US-9716060-B2
Application number	US-201514692769-A
Country	US
Kind code	B2
Filing date	Apr 22, 2015
Priority date	Sep 12, 2014
Publication date	Jul 25, 2017
Grant date	Jul 25, 2017

Abstract

The present invention provides a package structure with an embedded electronic component and a method of fabricating the package structure. The method includes: forming a first wiring layer on a carrier; removing the carrier and forming the first wiring layer on a bonding carrier; disposing an electronic component on the first wiring layer; forming an encapsulating layer, a second wiring layer and an insulating layer on the first wiring layer; disposing a chip on the electronic component and the second wiring layer; and forming a covering layer that covers the chip. The present invention can effectively reduce the thickness of the package structure and the electronic component without using adhesives.

First claim

What is claimed is:

1. A package structure with an embedded component, comprising:
an encapsulating layer having opposing first and second surfaces, and a plurality of first holes communicated with the second surface;
a first wiring layer embedded in the encapsulating layer and exposed from the first surface of the encapsulating layer, wherein the first holes expose a portion of the first wiring layer, and the first wiring layer is free from being located inside the first holes;
an electronic component embedded in the encapsulating layer whose surface is flush with and exposed from the first surface of the encapsulating layer;
a second wiring layer formed on the second surface of the encapsulating layer and in the first holes and electrically connected with the first wiring layer; and
a first insulating layer formed on and in direct contact with the second surface of the encapsulating layer.

2. The package structure of claim 1 , wherein the first insulating layer has a plurality of third holes corresponding in position to the first holes.

3. The package structure of claim 2 , wherein the second wiring layer has a portion formed in the first holes and extending to the third holes.

4. The package structure of claim 1 , further comprising a second insulating layer formed on the first surface of the encapsulating layer and on the first wiring layer, with a portion of the first wiring layer or the electronic component exposed from the second insulating layer.

5. The package structure of claim 1 , further comprising a chip provided with a plurality of conductors that are electrically connected with the first wiring layer.

6. The package structure of claim 5 , further comprising a covering layer formed on the first surface of the encapsulating layer for covering the chip.

7. The package structure of claim 6 , wherein the chip has a top surface exposed from the covering layer.

8. The package structure of claim 5 , wherein the conductors are solder bumps or copper pillars.

9. The package structure of claim 5 , further comprising a plurality of connection pads formed between the first wiring layer and the conductors.

10. The package structure of claim 1 , wherein the first wiring layer has a second surface flush with the first surface of the encapsulating layer.

11. The package structure of claim 1 , wherein the encapsulating layer is made of a photosensitive material or epoxy resin.

12. The package structure of claim 1 , wherein the electronic component is an active component or a passive component.

Assignees

• Siliconware Precision Industries Co Ltd

Inventors

• Chiu Shih-Chao
• Lin Chun-Hsien
• Pai Yu-Cheng
• Hsiao Wei-Chung
• Sun Ming-Chen
• Shen Tzu-Chieh
• Chen Chia-Cheng

Classifications

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/354

  comprising polymers · CPC title