Electrodeposition systems and methods that minimize anode and/or plating solution degradation
US-10041183-B2 · Aug 7, 2018 · US
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Perfecto Eric D patents
Perfecto Eric D is listed as an inventor on 28 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Perfecto Eric D |
| Total patents | 28 |
| First publication | Jan 20, 2015 |
| Latest publication | Aug 7, 2018 |
Notable patents
Publications ranked by popularity score, then publication date.
Structure for establishing interconnects in packages using thin interposers
US-10002835-B2 · Jun 19, 2018 · US
Fan-out circuit packaging with integrated lid
US-2018166356-A1 · Jun 14, 2018 · US
Semiconductor device contact structure having stacked nickel, copper, and tin layers
US-9853006-B2 · Dec 26, 2017 · US
Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer
US-9728440-B2 · Aug 8, 2017 · US
Electrodeposition systems and methods that minimize anode and/or plating solution degradation
US-2017211199-A1 · Jul 27, 2017 · US
Electrodeposition systems and methods that minimize anode and/or plating solution degradation
US-9689084-B2 · Jun 27, 2017 · US
Method and structure for establishing interconnects in packages using thin interposers
US-2017148737-A1 · May 25, 2017 · US
Method for establishing interconnects in packages using thin interposers
US-9607973-B1 · Mar 28, 2017 · US
Silver alloying post-chip join
US-9576922-B2 · Feb 21, 2017 · US
Recent patents
Latest publications not already listed above.
Silver alloying post-chip join
US-2016329289-A1 · Nov 10, 2016 · US
Layered contact structure
US-2016307860-A1 · Oct 20, 2016 · US
Multilayered contact structure having nickel, copper, and nickel-iron layers
US-9396991-B2 · Jul 19, 2016 · US
Electromigration-resistant lead-free solder interconnect structures
US-9379007-B2 · Jun 28, 2016 · US
Universal solder joints for 3D packaging
US-9343420-B2 · May 17, 2016 · US
Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer
US-2016118287-A1 · Apr 28, 2016 · US
Use of electrolytic plating to control solder wetting
US-9324669-B2 · Apr 26, 2016 · US
Use of electrolytic plating to control solder wetting
US-2016079193-A1 · Mar 17, 2016 · US
Multilayered contact structure having nickel, copper, and nickel-iron layers
US-2016056072-A1 · Feb 25, 2016 · US
Electrodeposition systems and methods that minimize anode and/or plating solution degradation
US-2015337451-A1 · Nov 26, 2015 · US
Organic coating to inhibit solder wetting on pillar sidewalls
US-2015333025-A1 · Nov 19, 2015 · US
Organic coating to inhibit solder wetting on pillar sidewalls
US-9190376-B1 · Nov 17, 2015 · US
Contact and solder ball interconnect
US-9177928-B1 · Nov 3, 2015 · US
Contact and solder ball interconnect
US-2015311170-A1 · Oct 29, 2015 · US
Under ball metallurgy (UBM) for improved electromigration
US-9142501-B2 · Sep 22, 2015 · US
Universal solder joints for 3d packaging
US-2015235979-A1 · Aug 20, 2015 · US
Under ball metallurgy (UBM) for improved electromigration
US-9084378-B2 · Jul 14, 2015 · US
Far back end of the line metallization method and structures
US-8937009-B2 · Jan 20, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Globalfoundries Inc | 15 |
| IBM | 13 |
| Globalfounries Inc | 1 |
| Globalfoundries Inc | 1 |
| Globalfoundries | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/252 | 20 |
| H10W72/01235 | 17 |
| H10W72/072 | 16 |
| H10W72/012 | 15 |
| H10W72/222 | 14 |