Under ball metallurgy (UBM) for improved electromigration

Patent metadata

Field	Value
Publication number	US-9084378-B2
Application number	US-201313829242-A
Country	US
Kind code	B2
Filing date	Mar 14, 2013
Priority date	Mar 14, 2013
Publication date	Jul 14, 2015
Grant date	Jul 14, 2015

Abstract

An interconnect structure that includes a substrate having an electrical component present therein, and a under-bump metallurgy (UBM) stack that is present in contact with a contact pad to the electrical component that is present in the substrate. The UBM stack includes a metallic adhesion layer that is direct contact with the contact pad to the electrical component, a copper (Cu) seed layer that is in direct contact with the metallic adhesion layer, a first nickel (Ni) barrier layer that is present in direct contact with copper (Cu) seed layer, and a layered structure of at least one copper (Cu) conductor layer and at least one second nickel (Ni) barrier layer present on the first nickel (Ni) barrier layer. A solder ball may be present on second nickel (Ni) barrier layer.

First claim

What is claimed is:

1. A method of forming an interconnect structure comprising:
forming a metallic adhesion layer on a contact pad to an electrical component that is present in a substrate;
forming a copper (Cu) seed layer on the metallic adhesion layer;
forming a barrier layer in direct contact with the copper (Cu) seed layer, wherein the barrier layer protects the copper (Cu) seed layer from reacting with later formed metallic layers and is selected from the group consisting of titanium (Ti), a Ti-cobalt (Co) alloy, a Ti—Ni alloy, a Ti—Co—Ni alloy and a Ni—Ti alloy;
forming a copper (Cu) conductor layer on the barrier layer;
and
forming a solder ball atop the copper conductor layer.

2. The method of claim 1 , wherein at least one of said forming said metallic adhesion layer and said forming said copper (Cu) seed layer comprises a sputtering process.

3. The method of claim 1 , wherein the copper (Cu) seed layer has a thickness ranging from 1500 Å to 5000 Å.

4. The method of claim 1 , wherein at least one of forming the barrier layer, and the copper (Cu) conductor layer comprises a plating process.

5. The method of claim 1 , wherein the barrier layer has a thickness ranging from 0.5 microns to 2 microns.

6. The method of claim 1 , wherein the metallic adhesion layer comprises a titanium tungsten (TiW) alloy layer.

7. An interconnect structure comprising:
a substrate having an electrical component present therein;
a under-bump metallurgy (UBM) stack that is present in contact with a contact pad to the electrical component that is present in the substrate, wherein the UBM stack includes a metallic adhesion layer that is in direct contact with the contact pad to the electrical component, a copper (Cu) seed layer that is in direct contact with the metallic adhesion layer, a barrier layer selected from the group consisting of titanium (Ti), a Ti-cobalt (Co) alloy, a Ti—Ni alloy and a Ti—Co—Ni alloy that is present in direct contact with the copper (Cu) seed layer, and a conductor stack including at least one copper containing conductor layer on the barrier layer; and
a solder ball present on the conductor stack.

8. The interconnect structure of claim 7 , wherein the conductor stack comprises a first copper (Cu) conductor layer in direct contact with the barrier layer, a nickel (Ni) barrier layer in direct contact with the first copper (Cu) conductor layer, and a second copper (Cu) conductor layer in direct contact with the nickel (Ni) barrier layer.

9. The interconnect structure of claim 7 , wherein the copper (Cu) seed layer is comprised of greater than 97 at. % copper (Cu).

10. The interconnect structure of claim 7 , wherein the copper (Cu) seed layer has a thickness ranging from 1500 Å to 5000 Å.

11. The interconnect structure of claim 7 , wherein the barrier layer has a thickness ranging from 0.5 microns to 20 microns.

12. The interconnect structure of claim 7 , wherein the solder ball has a composition selected from the group consisting of tin, silver and copper and a combination thereof.

13. The interconnect structure of claim 7 , wherein the metallic adhesion layer is comprised of a titanium-tungsten (TiW) alloy layer.

14. An interconnect structure comprising:
a substrate having an electrical component present therein;
a under-bump metallurgy (UBM) stack that is present in contact with a contact pad to the electrical component that is present in the substrate, wherein the UBM stack includes a metallic adhesion layer that is direct contact with the contact pad to the electrical component, a copper (Cu) seed layer that is in direct contact with the metallic adhesion layer, a nickel (Ni) barrier layer that is alloyed with at least titanium (Ti) and is present in direct contact with the copper (Cu) seed layer; and
a solder ball that is in direct contact with the nickel (Ni) barrier layer.

15. The interconnect structure of claim 14 , wherein the nickel (Ni) barrier layer further includes cobalt (Co).

16. The interconnect structure of claim 14 , wherein the nickel (Ni) barrier layer has a reaction rate that is slower than a reaction rate of copper (Cu).

Assignees

• IBM

Inventors

• Arvin Charles L
• Lu Minhua
• Perfecto Eric D
• Semkow Krystyna W
• Wassick Thomas A

Classifications

• H10W95/00

  Packaging processes not covered by the other groups of this subclass · CPC title

• H10W72/29

  Bond pads specially adapted therefor · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W72/923

  Bond pads having multiple stacked layers · CPC title