Bonding wire for semiconductor devices
US-12581982-B2 · Mar 17, 2026 · US
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Oyamada Tetsuya patents
Oyamada Tetsuya is listed as an inventor on 53 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Oyamada Tetsuya |
| Total patents | 53 |
| First publication | Oct 27, 2016 |
| Latest publication | Mar 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Al bonding wire
US-12532767-B2 · Jan 20, 2026 · US
Al ALLOY BONDING WIRE
US-2025379177-A1 · Dec 11, 2025 · US
AG alloy bonding wire for semiconductor devices and semiconductor device
US-12463172-B2 · Nov 4, 2025 · US
Copper bonding wire for semiconductor devices and semiconductor device
US-12463171-B2 · Nov 4, 2025 · US
Bonding wire for semiconductor devices
US-12412864-B2 · Sep 9, 2025 · US
Al bonding wire
US-12388044-B2 · Aug 12, 2025 · US
Copper bonding wire
US-12334467-B2 · Jun 17, 2025 · US
AI wiring material
US-12325901-B2 · Jun 10, 2025 · US
Bonding wire for semiconductor devices
US-12166006-B2 · Dec 10, 2024 · US
Recent patents
Latest publications not already listed above.
Bonding wire
US-12132025-B2 · Oct 29, 2024 · US
Ai bonding wire for semiconductor devices
US-2024312946-A1 · Sep 19, 2024 · US
Al bonding wire
US-12090578-B2 · Sep 17, 2024 · US
Bonding wire for semiconductor devices
US-2024266313-A1 · Aug 8, 2024 · US
Ai wiring material
US-2024110262-A1 · Apr 4, 2024 · US
Ai wiring material
US-2024105668-A1 · Mar 28, 2024 · US
Al BONDING WIRE FOR SEMICONDUCTOR DEVICES
US-2024071978-A1 · Feb 29, 2024 · US
Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
US-2023402422-A1 · Dec 14, 2023 · US
Al WIRING MATERIAL
US-2023302584-A1 · Sep 28, 2023 · US
Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE
US-2023154884-A1 · May 18, 2023 · US
Bonding wire for semiconductor devices
US-2023148306-A1 · May 11, 2023 · US
Al bonding wire
US-2023146315-A1 · May 11, 2023 · US
Al bonding wire
US-2023142531-A1 · May 11, 2023 · US
Copper bonding wire
US-2023105851-A1 · Apr 6, 2023 · US
Ag alloy bonding wire for semiconductor device
US-11612966-B2 · Mar 28, 2023 · US
Copper bonding wire for semiconductor devices and semiconductor device
US-2023013769-A1 · Jan 19, 2023 · US
Al wiring material
US-2022341004-A1 · Oct 27, 2022 · US
Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
US-2022266396-A1 · Aug 25, 2022 · US
Bonding wire for semiconductor devices
US-11342299-B2 · May 24, 2022 · US
Al bonding wire
US-2022152749-A1 · May 19, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Nippon Micrometal Corp | 53 |
| Nippon Steel Chemical & Mat Co Ltd | 43 |
| Nippon Steel & Sumikin Mat Co | 9 |
| Nippon Street Chemical & Matertial Corp Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/50 | 52 |
| H01L24/45 | 51 |
| H10W72/01565 | 43 |
| H10W72/5525 | 37 |
| H10W72/552 | 36 |