Metal sheet material, layered body, insulated circuit board, and metal sheet material manufacturing method
US-12563666-B2 · Feb 24, 2026 · US
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Ohashi Toyo patents
Ohashi Toyo is listed as an inventor on 24 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ohashi Toyo |
| Total patents | 24 |
| First publication | Sep 22, 2016 |
| Latest publication | Feb 24, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Insulated circuit board with integrated heat sink, and electronic device
US-2025193993-A1 · Jun 12, 2025 · US
Bonded body and insulating circuit board
US-2025024610-A1 · Jan 16, 2025 · US
Insulating resin circuit substrate
US-12177962-B2 · Dec 24, 2024 · US
Bonded body and insulating circuit board
US-12137526-B2 · Nov 5, 2024 · US
Insulated circuit substrate manufacturing method
US-12133338-B2 · Oct 29, 2024 · US
Insulating circuit board
US-12108528-B2 · Oct 1, 2024 · US
Heat sink integrated insulating circuit board
US-12068219-B2 · Aug 20, 2024 · US
Metal sheet material, layered body, insulated circuit board, and metal sheet material manufacturing method
US-2024178115-A1 · May 30, 2024 · US
Heatsink-integrated insulating circuit board and method for manufacturing heatsink-integrated insulating circuit board
US-2023411266-A1 · Dec 21, 2023 · US
Recent patents
Latest publications not already listed above.
Insulating resin circuit substrate
US-2023319975-A1 · Oct 5, 2023 · US
Manufacturing method for insulating resin circuit substrate
US-2023207333-A1 · Jun 29, 2023 · US
Bonded body and insulating circuit board
US-2023164924-A1 · May 25, 2023 · US
Insulated circuit substrate manufacturing method
US-2023127557-A1 · Apr 27, 2023 · US
Heat sink integrated insulating circuit board
US-2023071498-A1 · Mar 9, 2023 · US
Insulating circuit board
US-2022159829-A1 · May 19, 2022 · US
Insulating circuit substrate and method for producing insulating circuit substrate
US-11222835-B2 · Jan 11, 2022 · US
Insulating circuit substrate and method for producing insulating circuit substrate
US-2021020557-A1 · Jan 21, 2021 · US
Method for manufacturing insulated circuit board, insulated circuit board, and thermoelectric conversion module
US-10798824-B2 · Oct 6, 2020 · US
Power module substrate
US-10453783-B2 · Oct 22, 2019 · US
Power module substrate
US-2019189548-A1 · Jun 20, 2019 · US
Method for manufacturing insulated circuit board, insulated circuit board, and thermoelectric conversion module
US-2019132956-A1 · May 2, 2019 · US
Power module
US-9953944-B2 · Apr 24, 2018 · US
Power module
US-2016276302-A1 · Sep 22, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Mitsubishi Materials Corp | 24 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/255 | 20 |
| H10W70/60 | 13 |
| H05K3/0061 | 12 |
| H05K1/056 | 12 |
| H10W90/734 | 10 |