Bonded body and insulating circuit board

Patent metadata

Field	Value
Publication number	US-12137526-B2
Application number	US-202117915129-A
Country	US
Kind code	B2
Filing date	Mar 29, 2021
Priority date	Mar 30, 2020
Publication date	Nov 5, 2024
Grant date	Nov 5, 2024

Abstract

A bonded body has a structure in which an insulating resin member made of an insulating resin and a metal part made of a metal are bonded. In the bonded body, a bonded interface between the insulating resin member and the metal part has an uneven shape including a protrusion in which the metal part protrudes toward an insulating resin member side and a recess in which the metal part retracts from the insulating resin member side, at least one of a kurtosis Rku of contour curve at the bonded interface of the metal part and a kurtosis Sku of contour surface at the bonded interface of the metal part is in a range of 2.75 or more and 6.00 or less, and an overhang rate that indicates a length ratio of regions overlapping in a lamination direction in a direction along the bonded interface is 7% or more.

First claim

What is claimed is:

1. A bonded body having a structure in which an insulating resin member made of an insulating resin and a metal part made of a metal are bonded,
wherein a bonded interface between the insulating resin member and the metal part has an uneven shape including a protrusion in which the metal part protrudes toward an insulating resin member side and a recess in which the metal part retracts from the insulating resin member side,
at least one of a kurtosis Rku of contour curve at the bonded interface of the metal part and a kurtosis Sku of contour surface at the bonded interface of the metal part is in a range of 2.75 or more and 6.00 or less, and
an overhang rate that indicates a length ratio of regions overlapping in a lamination direction in a direction along the bonded interface is 7% or more.

2. The bonded body according to claim 1 ,
wherein at least one of a root mean square deviation Rq of contour curve at the bonded interface of the metal part and a root mean square deviation Sq of contour surface at the bonded interface of the metal part is in a range of 0.20 μm or more and 0.90 μm or less.

3. An insulating circuit board comprising:
an insulating resin layer; and
a circuit layer in which a metal plate is bonded to one surface of the insulating resin layer,
wherein a bonded interface between the insulating resin layer and the circuit layer has an uneven shape including a protrusion in which the circuit layer protrudes toward an insulating resin layer side and a recess in which the circuit layer retracts from the insulating resin layer side,
at least one of a kurtosis Rku of contour curve at the bonded interface of the circuit layer and a kurtosis Sku of contour surface at the bonded interface of the circuit layer is in a range of 2.75 or more and 6.00 or less, and
an overhang rate that indicates a length ratio of regions overlapping in a lamination direction in a direction along the bonded interface is 7% or more.

4. The insulating circuit board according to claim 3 ,
wherein at least one of a root mean square deviation Rq of contour curve at the bonded interface of the circuit layer and a root mean square deviation Sq of contour surface at the bonded interface of the circuit layer is in a range of 0.20 μm or more and 0.90 μm or less.

Assignees

• Mitsubishi Materials Corp

Inventors

• SAKAMAKI Marina
• Kubota Kenji
• Ohashi Toyo

Classifications

• H10W70/6525

  for securing the interconnections to the substrate, e.g. to prevent peeling · CPC title

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W70/6875

  being on a metallic substrate, e.g. insulated metal substrates [IMS] · CPC title

• H10W70/60 Primary

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H05K1/0284

  Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014) · CPC title