Metal sheet material, layered body, insulated circuit board, and metal sheet material manufacturing method

Patent metadata

Field	Value
Publication number	US-12563666-B2
Application number	US-202218283519-A
Country	US
Kind code	B2
Filing date	Mar 23, 2022
Priority date	Mar 26, 2021
Publication date	Feb 24, 2026
Grant date	Feb 24, 2026

Abstract

This metal sheet material is made of copper or a copper alloy, and includes a main sheet body and a roughened plating layer that is formed on an outermost surface layer of the main sheet body. An engagement protrusion that protrudes toward the opposite side to the main sheet body and has a widening portion that gradually widens in width toward a tip end side in a protrusion direction is formed in the roughened plating layer. In a cross section of the main sheet body along the thickness direction, a plurality of the engagement protrusions are formed on a surface crystal grain that is located on the outermost surface of the main sheet body.

First claim

What is claimed is:

1 . A metal sheet material made of copper or a copper alloy, comprising: a main sheet body; and a roughened plating layer that is formed on an outermost surface layer of the main sheet body, wherein an engagement protrusion that protrudes toward an opposite side to the main sheet body and has a widening portion that gradually widens in width toward a tip end side in a protrusion direction is formed in the roughened plating layer, in a cross section of the main sheet body and the roughened plating layer along a thickness direction, a plurality of the engagement protrusions are formed on a surface crystal grain that is located on the outermost surface of the main sheet body, when an interface between the main sheet body and the roughened plating layer, which is observed in the cross section of the main sheet body and the roughened plating layer along the thickness direction, is observed with a scanning electron microscope at a 1000-fold magnification, a measurement of a maximum width of the surface crystal grain in a field of view of 85 μm×120 μm is performed three times, and the maximum width of the surface crystal grain denoted by W (unit: μm) is defined as a maximum value among three measurements, the maximum width of the surface crystal grain is 3 μm or greater and 1000 μm or less, and when a number of the engagement protrusions in the maximum width of the surface crystal grain is denoted by N, and a protrusion height of the engagement protrusions is denoted by H (unit: μm), wherein N×H/W is 1.11 or smaller.

2 . The metal sheet material according to claim 1 , wherein the protrusion height of the engagement protrusions is 0.1 μm or greater.

3 . A layered body comprising:
the metal sheet material according to claim 1 ; and a resin member laminated on a sheet surface of the metal sheet material, wherein the resin member engages with the engagement protrusions of the metal sheet material at a bonded interface between the resin member and the metal sheet material.

4 . An insulated circuit board, comprising:
an insulating resin layer; and a circuit layer formed on one surface of the insulating resin layer, wherein the circuit layer is formed with the metal sheet material according to claim 1 bonded to the one surface of the insulating resin layer, and the insulating resin layer engages with the engagement protrusions of the metal sheet material at a bonded interface between the insulating resin layer and the circuit layer.

5 . A metal sheet material manufacturing method for manufacturing the metal sheet material according to claim 1 , the method comprising:
performing direct current electrolytic plating and then PR pulse electrolytic plating on the main sheet body to form the roughened plating layer on the outermost surface layer of the main sheet body.

Assignees

• Mitsubishi Materials Corp

Inventors

• SAKAMAKI Marina
• Kubota Kenji
• Ohashi Toyo

Classifications

• H10W72/30

  Die-attach connectors · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W70/05

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title