Insulating resin circuit substrate

Patent metadata

Field	Value
Publication number	US-2023319975-A1
Application number	US-202117928356-A
Country	US
Kind code	A1
Filing date	May 31, 2021
Priority date	Jun 1, 2020
Publication date	Oct 5, 2023
Grant date	—

Abstract

There is provided an insulating resin circuit substrate including an insulating resin layer and a circuit layer consisting of a plurality of metal pieces disposed to be spaced apart in a circuit pattern shape on one surface of the insulating resin layer, in which in a case where a surface of the insulating resin layer in a gap between the metal pieces is analyzed by SEM-EDX, the area rate of a metal element constituting the metal pieces is less than 2.5%.

First claim

1 . An insulating resin circuit substrate comprising:
an insulating resin layer; and a circuit layer consisting of a plurality of metal pieces disposed to be spaced apart in a circuit pattern shape on one surface of the insulating resin layer, wherein in a case where a surface of the insulating resin layer in a gap between the metal pieces is analyzed by SEM-EDX, an area rate of a metal element constituting the metal pieces is less than 2.5%.

2 . The insulating resin circuit substrate according to claim 1 ,
wherein a heat radiation layer is formed on a surface of the insulating resin layer on a side opposite to the circuit layer, in a region of the heat radiation layer, a joining rate of the insulating resin layer to the heat radiation layer is 70% or more, where the region is located on a back surface of the gap between the metal pieces of the circuit layer, and the heat radiation layer is made of a material having a thermal conductivity higher than a thermal conductivity of the insulating resin layer.

3 . The insulating resin circuit substrate according to claim 1 ,
wherein the metal piece has a thickness t of 0.5 mm or more.

4 . The insulating resin circuit substrate according to claim 1 ,
wherein a ratio L/t of a closest distance L between the metal pieces to a thickness t of the metal piece disposed in the circuit pattern shape is 2.0 or less.

Assignees

• Mitsubishi Materials Corp

Inventors

• Sakaniwa Yoshiaki
• Ohashi Toyo

Classifications

• H05K1/0209 Primary

  External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings · CPC title

• H05K1/0313

  Organic insulating material · CPC title

• H05K2201/0154

  Polyimide · CPC title

• H05K2201/10227

  Other objects, e.g. metallic pieces · CPC title

• H05K3/0061

  onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20) · CPC title