Insulating circuit board

Patent metadata

Field	Value
Publication number	US-12108528-B2
Application number	US-202017439565-A
Country	US
Kind code	B2
Filing date	Mar 26, 2020
Priority date	Mar 26, 2019
Publication date	Oct 1, 2024
Grant date	Oct 1, 2024

Abstract

Provided is an insulating circuit board including: an insulating resin layer; and a circuit layer made of metal pieces, each of which is in a circuit pattern and provided on one surface of the insulating resin layer, wherein thickness of each of the metal pieces constituting the circuit layer is 0.5 mm or more, the insulating resin layer is made of a thermosetting resin, and a void ratio in regions between the metal pieces is 0.8% or less.

First claim

What is claimed is:

1. An insulating circuit board comprising:
an insulating resin layer; and
a circuit layer made of metal pieces, each of which is in a circuit pattern and provided on one surface of the insulating resin layer, wherein
thickness t of each of the metal pieces constituting the circuit layer is 0.5 mm or more,
a closest distance L between the metal pieces provided in the circuit pattern is within a range of 1.0 mm or more and 1.5 mm or less,
a ratio L/t is 1.0 or less,
the insulating resin layer is made of a thermosetting resin, a void ratio B 1 of a region between the metal pieces is 0.8% or less, and a ratio B 2 /B 1 of a void ratio B 2 of a region where the metal piece is disposed to the void ratio B 1 of the region between the metal pieces is within a range of 0.5 or more and 1.5 or less, and
an angle θ between an end portion of each of the metal pieces and a surface of the insulating resin layer is within a range of 70° or more and 110° or less.

2. The insulating circuit board according to claim 1 , wherein
a thermal dissipation layer is formed on a surface of the insulating resin layer opposite to the circuit layer.

3. A method for manufacturing the insulating circuit board according to claim 1 , the method comprising:
a metal piece forming step of forming the metal piece to be the circuit layer;
a resin composition providing step of providing a resin composition to be a thermal dissipation layer on one surface of a metal plate;
a metal piece disposing step of disposing a plurality of the metal pieces in a circuit pattern on one surface of the resin composition; and
a pressurizing and heating step of pressurizing and heating the metal plate, the resin composition, and the metal pieces in a laminating direction, wherein
in the pressurizing and heating step, a rubber-like elastic body is disposed on the metal piece side, and the metal pieces are pressed against the resin composition side, and the thermal dissipation layer and the circuit layer are formed by forming an insulation layer by curing the resin composition, by bonding the metal plate and the insulating layer and by bonding the insulating layer and the metal pieces.

Assignees

• Mitsubishi Materials Corp

Inventors

• Sakaniwa Yoshiaki
• Ohashi Toyo

Classifications

• H10W70/60 Primary

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W40/10

  Arrangements for heating · CPC title

• H10W40/255 Primary

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10H20/8585

  being an interconnection · CPC title

• H10H20/8583

  not being in contact with the bodies · CPC title