Electronic package module and method for fabrication of the same
US-2024413067-A1 · Dec 12, 2024 · US
Insulated circuit substrate manufacturing method
US2023127557A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2023127557-A1 |
| Application number | US-202117913212-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 24, 2021 |
| Priority date | Mar 25, 2020 |
| Publication date | Apr 27, 2023 |
| Grant date | — |
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- Title
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Abstract
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An insulated circuit substrate manufacturing method of the present invention includes a metal piece disposing step of disposing the metal piece in a circuit pattern shape on a resin material serving as the insulating resin layer and a bonding step of bonding the insulating resin layer and the metal piece by pressurizing and heating the resin material and the metal piece at least in a laminating direction. In the bonding step, the metal piece and the resin material are pressurized in the laminating direction by a pressurizing jig that includes a cushion material disposed on a side of the metal piece and a guide wall portion disposed at a position facing a peripheral portion of the cushion material, and the peripheral portion of the cushion material is brought into contact with the guide wall portion during pressurization.
First claim
Opening claim text (preview).
1 . A manufacturing method for an insulated circuit substrate including an insulating resin layer and a circuit layer consisting of a metal piece arranged in a circuit pattern shape on one surface of the insulating resin layer, the manufacturing method for the insulated circuit substrate comprising: a metal piece disposing step of disposing the metal piece to form a circuit pattern shape on a resin material to be the insulating resin layer; and a bonding step of bonding the insulating resin layer and the metal piece by pressurizing and heating the resin material and the metal piece at least in a laminating direction, wherein in the bonding step, the metal piece and the resin material are pressurized in the laminating direction by a pressurizing jig that includes a cushion material disposed on a side of the metal piece and a guide wall portion disposed at a position facing a peripheral portion of the cushion material, and the peripheral portion of the cushion material is brought into contact with the guide wall portion during pressurization. 2 . The insulated circuit substrate manufacturing method according to claim 1 , wherein a hardness of the guide wall portion is larger than a hardness of the cushion material. 3 . The insulated circuit substrate manufacturing method according to claim 1 , wherein the guide wall portion is arranged on the resin material side of the pressurizing jig. 4 . The insulated circuit substrate manufacturing method according to claim 1 , wherein the insulated circuit substrate further includes a heat dissipation layer disposed on the other surface of the insulating resin layer, and in the bonding step, the metal piece and the insulating resin layer, and the heat dissipation layer and the insulating resin layer are bonded to each other at the same time. 5 . The insulated circuit substrate manufacturing method according to claim 1 , wherein the resin material is an epoxy resin, and in the bonding step, the resin material is cured to form the insulating resin layer. 6 . The insulated circuit substrate manufacturing method according to claim 1 , wherein the resin material is a polyimide resin. 7 . The insulated circuit substrate manufacturing method according to claim 1 , wherein the cushion material is made of silicone rubber.
Assignees
Inventors
Classifications
- H10W70/05Primary
of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title
of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title
- H10W40/255Primary
having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title
using self-supporting metal foil pattern · CPC title
the metal substrate being covered by an organic insulating layer · CPC title
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- What does patent US2023127557A1 cover?
- An insulated circuit substrate manufacturing method of the present invention includes a metal piece disposing step of disposing the metal piece in a circuit pattern shape on a resin material serving as the insulating resin layer and a bonding step of bonding the insulating resin layer and the metal piece by pressurizing and heating the resin material and the metal piece at least in a laminating…
- Who is the assignee on this patent?
- Mitsubishi Materials Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W70/05. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Apr 27 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).