Insulating circuit substrate and method for producing insulating circuit substrate

Patent metadata

Field	Value
Publication number	US-11222835-B2
Application number	US-201916980623-A
Country	US
Kind code	B2
Filing date	Mar 1, 2019
Priority date	Mar 23, 2018
Publication date	Jan 11, 2022
Grant date	Jan 11, 2022

Abstract

An insulating circuit substrate includes an insulating layer; and a circuit layer formed on one surface of the insulating layer, in which the insulating layer has a core layer formed of an epoxy resin containing an inorganic filler, and a skin layer formed on the circuit layer side of the core layer and formed of a polyimide resin containing an inorganic filler, an amount of the inorganic filler in the epoxy resin forming the core layer is in a range of 80 vol % or more and 95 vol % or less, and an amount of the inorganic filler in the polyimide resin forming the skin layer is in a range of 10 vol % or more and 30 vol % or less.

First claim

What is claimed is:

1. An insulating circuit substrate comprising:
an insulating layer; and
a circuit layer formed on one surface of the insulating layer,
wherein the insulating layer has a core layer formed of an epoxy resin containing an inorganic filler, and a skin layer formed of a polyimide resin containing an inorganic filler and formed on the circuit layer side of the core layer,
the inorganic filler in the epoxy resin is made of Al 2 O 3 , BN or AlN, or a mixture thereof,
an amount of the inorganic filler in the epoxy resin forming the core layer is in a range of 80 vol % or more and 95 vol % or less,
an amount of the inorganic filler in the polyimide resin forming the skin layer is in a range of 10 vol % or more and 30 vol % or less,
a ratio of the thickness of the skin layer to a thickness of the core layer is 0.020 to 0.071, and
a thickness of the skin layer is 3 μm to 5 μm.

2. The insulating circuit substrate according to claim 1 ,
wherein a metal layer is formed on a surface of the insulating layer on an opposite side to the circuit layer, and a skin layer formed of a polyimide resin is formed on the metal layer side of the core layer.

3. A method for manufacturing an insulating circuit substrate by which the insulating circuit substrate according to claim 1 is manufactured, the method comprising:
a core layer forming step of forming a core layer by curing an epoxy resin composition including an inorganic filler and an epoxy resin;
a polyimide resin composition providing step of providing a polyimide resin composition including an inorganic filler and a polyimide resin on a surface of the core layer;
a metal plate laminating step of laminating a metal plate to be a circuit layer on the polyimide resin composition; and
a thermocompression bonding step of pressing and heating the metal plate, the polyimide resin composition, and the core layer in a laminating direction, curing the polyimide resin composition to form a skin layer, and bonding the metal plate and the insulating layer to form the circuit layer.

4. A method for manufacturing an insulating circuit substrate by which the insulating circuit substrate according to claim 1 is manufactured, the method comprising:
a polyimide resin composition providing step of providing a polyimide resin composition including an inorganic filler and the polyimide resin, on a metal plate to be the circuit layer;
an epoxy resin composition laminating step of laminating an epoxy resin composition including an inorganic filler and an epoxy resin on the polyimide resin composition; and
a thermocompression bonding step of pressing and heating the metal plate, the polyimide resin composition, and the epoxy resin composition in a laminating direction, curing the polyimide resin composition to form a skin layer, curing the epoxy resin composition to form the core layer, and bonding the metal plate and the insulating layer to form the circuit layer.

5. The insulating circuit substrate according to claim 1 , wherein the inorganic filler in the polyamide resin is made of Al 2 O 3 , BN or AlN, or a mixture thereof.

6. The insulating circuit substrate according to claim 1 , wherein a lower limit of the amount of inorganic filler in the epoxy resin is 85 vol %.

7. The insulating circuit substrate according to claim 1 , wherein a lower limit of the amount of inorganic filler in the epoxy resin is 90 vol %.

8. The insulating circuit substrate according to claim 1 , wherein an upper limit of the amount of inorganic filler in the polyimide resin is 25 vol %.

9. A method for manufacturing an insulating circuit substrate by which the insulating circuit substrate according to claim 2 is manufactured, the method comprising:
a core layer forming step of forming a core layer by curing an epoxy resin composition including an inorganic filler and an epoxy resin;
a polyimide resin composition providing step of providing a polyimide resin composition including an inorganic filler and a polyimide resin on a surface of the core layer;
a metal plate laminating step of laminating a metal plate to be a circuit layer on the polyimide resin composition; and
a thermocompression bonding step of pressing and heating the metal plate, the polyimide resin composition, and the core layer in a laminating direction, curing the polyimide resin composition to form a skin layer, and bonding the metal plate and the insulating layer to form the circuit layer.

10. A method for manufacturing an insulating circuit substrate by which the insulating circuit substrate according to claim 2 is manufactured, the method comprising:
a polyimide resin composition providing step of providing a polyimide resin composition including an inorganic filler and the polyimide resin, on a metal plate to be the circuit layer;
an epoxy resin composition laminating step of laminating an epoxy resin composition including an inorganic filler and an epoxy resin on the polyimide resin composition; and
a thermocompression bonding step of pressing and heating the metal plate, the polyimide resin composition, and the epoxy resin composition in a laminating direction, curing the polyimide resin composition to form a skin layer, curing the epoxy resin composition to form the core layer, and bonding the metal plate and the insulating layer to form the circuit layer.

11. The method for manufacturing an insulating circuit substrate according to claim 3 , further comprising:
a circuit pattern forming step of forming a circuit pattern by etching the metal plate to be the circuit layer after the thermocompression bonding step.

12. The method for manufacturing an insulating circuit substrate according to claim 3 ,
wherein a plurality of metal pieces provided in a circuit pattern are used as the metal plate and, in the thermocompression bonding step, a pressing member is disposed in a region, in which the metal pieces are not provided, and pressed.

13. The method for manufacturing an insulating circuit substrate according to claim 4 , further comprising:
a circuit pattern forming step of forming a circuit pattern by etching the metal plate to be the circuit layer after the thermocompression bonding step.

14. The method for manufacturing an insulating circuit substrate according to claim 4 ,
wherein a plurality of metal pieces provided in a circuit pattern are used as the metal plate and, in the thermocompression bonding step, a pressing member is disposed in a region, in which the metal pieces are not provided, and pressed.

15. The method for manufacturing an insulating circuit substrate according to claim 9 , further comprising:
a circuit pattern forming step of forming a circuit pattern by etching the metal plate to be the circuit layer after the thermocompression bonding step.

16. The method for manufacturing an insulating circuit substrate according to claim 9 ,
wherein a plurality of metal pieces provided in a circuit pattern are used as the metal plate and, in the thermocompression bonding step, a pressing member is disposed in a region, in which the metal pieces are not provided, and pressed.

17. The method for manufacturing an insulating circuit substrate according to claim 10 , further comprising:
a circuit pattern forming step of forming a circuit pattern by etching the metal plate to be the circuit layer after the thermocompression bonding step.

18. The method for manufacturing an insulating circuit substrate according to claim 10 ,
wherein a plurality of metal pieces provided in a circuit pattern are used as the metal plate and, in the

Assignees

• Mitsubishi Materials Corp

Inventors

• Sakaniwa Yoshiaki
• Ohashi Toyo

Classifications

• H10W70/695

  Organic materials · CPC title

• H10W70/69

  Insulating materials thereof · CPC title

• H10W70/05

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W40/251

  Organics · CPC title

• H10W70/685 Primary

  comprising multiple insulating layers · CPC title