Insulating circuit substrate and method for producing insulating circuit substrate
US-11222835-B2 · Jan 11, 2022 · US
Insulating circuit board
US2022159829A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2022159829-A1 |
| Application number | US-202017439565-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 26, 2020 |
| Priority date | Mar 26, 2019 |
| Publication date | May 19, 2022 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
Provided is an insulating circuit board including: an insulating resin layer; and a circuit layer made of metal pieces, each of which is in a circuit pattern and provided on one surface of the insulating resin layer, wherein thickness of each of the metal pieces constituting the circuit layer is 0.5 mm or more, the insulating resin layer is made of a thermosetting resin, and a void ratio in regions between the metal pieces is 0.8% or less.
First claim
Opening claim text (preview).
1 . An insulating circuit board comprising: an insulating resin layer; and a circuit layer made of metal pieces, each of which is in a circuit pattern and provided on one surface of the insulating resin layer, wherein thickness t of each of the metal pieces constituting the circuit layer is 0.5 mm or more, the insulating resin layer is made of a thermosetting resin, and a void ratio in regions between the metal pieces is 0.8% or less, and an angle θ between an end portion of each of the metal pieces and a surface of the insulating resin layer is within a range of 70° or more and 110° or less. 2 . The insulating circuit board according to claim 1 , wherein a ratio L/t is 1.0 or less, t being the thickness of each of the metal pieces in a circuit pattern and L being a closest distance between the metal pieces. 3 . The insulating circuit board according to claim 1 , wherein a thermal dissipation layer is formed on a surface of the insulating resin layer opposite to the circuit layer. 4 . A method for manufacturing the insulating circuit board according to claim 1 , the method comprising: a metal piece forming step of forming a metal piece to be a circuit layer; a resin composition providing step of providing a resin composition to be a thermal dissipation layer on one surface of a metal plate; a metal piece disposing step of disposing a plurality of the metal pieces in a circuit pattern on one surface of the resin composition; and a pressurizing and heating step of pressurizing and heating the metal plate, the resin composition, and the metal pieces in a laminating direction, wherein in the pressurizing and heating step, the thermal dissipation layer and the circuit layer are formed by forming an insulation layer by curing the resin composition, by bonding the metal plate and the insulating layer and by bonding the insulating layer and the metal pieces.
Assignees
Inventors
Classifications
- H10W70/60Primary
Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title
Arrangements for heating · CPC title
- H10W40/255Primary
having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title
being an interconnection · CPC title
not being in contact with the bodies · CPC title
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- What does patent US2022159829A1 cover?
- Provided is an insulating circuit board including: an insulating resin layer; and a circuit layer made of metal pieces, each of which is in a circuit pattern and provided on one surface of the insulating resin layer, wherein thickness of each of the metal pieces constituting the circuit layer is 0.5 mm or more, the insulating resin layer is made of a thermosetting resin, and a void ratio in reg…
- Who is the assignee on this patent?
- Mitsubishi Materials Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W70/60. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu May 19 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).