Surface treated copper foil, copper clad laminate, and printed circuit board

Patent metadata

Field	Value
Publication number	US-11337314-B2
Application number	US-201916497996-A
Country	US
Kind code	B2
Filing date	Apr 22, 2019
Priority date	Apr 27, 2018
Publication date	May 17, 2022
Grant date	May 17, 2022

Abstract

A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has a root mean square gradient of roughness curve elements RΔq according to JIS B0601:2013 of 5 to 28°. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to the first surface treatment layer 3 of the surface treated copper foil 1.

First claim

The invention claimed is:

1. A surface treated copper foil comprising
a copper foil, and
a first surface treatment layer formed on one surface of the copper foil,
wherein the first surface treatment layer comprises a root mean square gradient of roughness curve elements RΔq according to JIS B0601:2013 of 5° to 28°.

2. The surface treated copper foil according to claim 1 , wherein the RΔq is from 10° to 25°.

3. The surface treated copper foil according to claim 1 , wherein the RΔq is from 15° to 23°.

4. The surface treated copper foil according to claim 1 , wherein the first surface treatment layer comprises a kurtosis of a roughness curve Rku according to JIS B0601:2013 of 2.0 to 8.0.

5. The surface treated copper foil according to claim 4 , wherein the Rku is from 3.5 to 5.8.

6. The surface treated copper foil according to claim 1 , wherein the first surface treatment layer comprises a* of a CIE L*a*b* color space of 3.0 to 28.0.

7. The surface treated copper foil according to claim 6 , wherein the a* is from 5.0 to 23.0.

8. The surface treated copper foil according to claim 1 , wherein the first surface treatment layer comprises a Ni deposited amount of 20 to 200 μg/dm 2 and a Zn deposited amount of 20 to 1,000 μg/dm 2 .

9. The surface treated copper foil according to claim 1 , wherein the first surface treatment layer comprises a Cu concentration of 80 to 100 atm % based on the total amount of elements of C, N, O, Zn, Cr, Ni, Co, Si, and Cu, in an XPS depth profile obtained by performing sputtering at a sputtering rate of 2.5 nm/min (in terms of SiO 2 ) for 7 minutes.

10. The surface treated copper foil according to claim 1 , wherein the first surface treatment layer satisfies at least one of the following items (A) to (F):
(A) a kurtosis of a roughness curve Rku according to JIS B0601:2013 of 2.0 to 8.0;
(B) a* of a CIE L*a*b* color space measured according to the geometric condition C of JIS Z8730:2009 of 3.0 to 28.0;
(C) a Cu concentration of 80 to 100 atm % based on the total amount of elements of C, N, O, Zn, Cr, Ni, Co, Si, and Cu, in an XPS depth profile obtained by performing sputtering at a sputtering rate of 2.5 nm/min (in terms of SiO 2 ) for 7 minutes;
(D) an average length of roughness curve elements RSm according to JIS B0601:2013 of 5 to 10 μm;
(E) an average length of roughness motifs AR according to JIS B0631:2000 of 6 to 20 μm; and
(F) a ten-point average roughness Rz according to JIS B0601:1994 of 0.3 to 1.5 μm.

11. The surface treated copper foil according to claim 1 , wherein a surface of the surface treated copper foil opposite to the first surface treatment layer comprises a ten-point average roughness Rz according to JIS B0601:1994 of 0.3 to 1.0 μm.

12. The surface treated copper foil according to claim 1 , wherein the copper foil is a rolled copper foil.

13. A copper clad laminate comprising
the surface treated copper foil according to claim 1 , and
an insulating substrate adhered to the first surface treatment layer of the surface treated copper foil.

14. A printed circuit board comprising a circuit pattern formed by etching the surface treated copper foil of the copper clad laminate according to claim 13 .

15. The surface treated copper foil according to claim 4 , wherein the first surface treatment layer comprises a* of a CIE L*a*b* color space of 5.0 to 23.0.

16. The surface treated copper foil according to claim 4 , wherein the first surface treatment layer comprises a Ni deposited amount of 20 to 200 μg/dm 2 and a Zn deposited amount of 20 to 1,000 μg/dm 2 .

17. The surface treated copper foil according to claim 4 , wherein the first surface treatment layer comprises a Cu concentration of 80 to 100 atm % based on the total amount of elements of C, N, O, Zn, Cr, Ni, Co, Si, and Cu, in an XPS depth profile obtained by performing sputtering at a sputtering rate of 2.5 nm/min (in terms of SiO 2 ) for 7 minutes.

18. The surface treated copper foil according to claim 15 , wherein the first surface treatment layer comprises a Ni deposited amount of 20 to 200 μg/dm 2 and a Zn deposited amount of 20 to 1,000 μg/dm 2 .

19. The surface treated copper foil according to claim 15 , wherein the first surface treatment layer comprises a Cu concentration of 80 to 100 atm % based on the total amount of elements of C, N, O, Zn, Cr, Ni, Co, Si, and Cu, in an XPS depth profile obtained by performing sputtering at a sputtering rate of 2.5 nm/min (in terms of SiO 2 ) for 7 minutes.

20. The surface treated copper foil according to claim 1 , wherein the first surface treatment layer satisfies five or six of the following items (A) to (F):
(A) a kurtosis of a roughness curve Rku according to JIS B0601:2013 of 2.0 to 8.0;
(B) a* of a CIE L*a*b* color space measured according to the geometric condition C of JIS Z8730:2009 of 3.0 to 28.0;
(C) a Cu concentration of 80 to 100 atm % based on the total amount of elements of C, N, O, Zn, Cr, Ni, Co, Si, and Cu, in an XPS depth profile obtained by performing sputtering at a sputtering rate of 2.5 nm/min (in terms of SiO 2 ) for 7 minutes;
(D) an average length of roughness curve elements RSm according to JIS B0601:2013 of 5 to 10 μm;
(E) an average length of roughness motifs AR according to JIS B0631:2000 of 6 to 20 μm; and
(F) a ten-point average roughness Rz according to JIS B0601:1994 of 0.3 to 1.5 μm.

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Miyamoto Nobuaki
• Miki Atsushi

Classifications

• C22C9/04

  with zinc as the next major constituent · CPC title

• C25D5/14

  two or more layers being of nickel or chromium, e.g. duplex or triplex layers · CPC title

• B32B2255/205

  Metallic coating · CPC title

• H05K2201/0338

  Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer · CPC title

• H05K3/022

  Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates · CPC title