Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device
US-10123433-B2 · Nov 6, 2018 · US
Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device
US10299385B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10299385-B2 |
| Application number | US-201615229194-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 5, 2016 |
| Priority date | Aug 6, 2015 |
| Publication date | May 21, 2019 |
| Grant date | May 21, 2019 |
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- Title
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Abstract
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Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum trough depth Sv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.181 to 2.922 μm.
First claim
Opening claim text (preview).
What is claimed is: 1. A carrier-attached copper foil comprising a carrier, an interlayer, and an ultrathin copper layer in this order, wherein the maximum trough depth Sv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.181 to 2.922 μm, and the ratio Sv/Svk of maximum trough depth Sv and projecting trough depth Svk as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 3.549 to 10.777. 2. The carrier-attached copper foil according to claim 1 , wherein the level difference Sk of a core portion as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.095 to 0.936 μm. 3. The carrier-attached copper foil according to claim 1 , wherein the projecting trough depth Svk as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.051 to 0.478 μm. 4. The carrier-attached copper foil according to claim 2 , wherein the projecting trough depth Svk as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.051 to 0.478 μm. 5. The carrier-attached copper foil according to claim 1 , wherein the trough space volume Vvv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.003 to 0.020 μm 3 /μm 2 . 6. The carrier-attached copper foil according to claim 2 , wherein the trough space volume Vvv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.003 to 0.020 μm 3 /μm 2 . 7. The carrier-attached copper foil according to claim 3 , wherein the trough space volume Vvv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.003 to 0.020 μm 3 /μm 2 . 8. The carrier-attached copper foil according to claim 4 , wherein the trough space volume Vvv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.003 to 0.020 μm 3 /μm 2 . 9. A carrier-attached copper foil comprising a carrier, an interlayer, and an ultrathin copper layer in this order, wherein the level difference Sk of a core portion as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.095 to 0.936 μm, and the ratio Sv/Svk of maximum trough depth Sv and projecting trough depth Svk as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 3.549 to 10.777. 10. The carrier-attached copper foil according to claim 9 , wherein the projecting trough depth Svk as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.051 to 0.478 μm. 11. The carrier-attached copper foil according to claim 9 , wherein the trough space volume Vvv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.003 to 0.020 μm 3 /μm 2 . 12. The carrier-attached copper foil according to claim 10 , wherein the trough space volume Vvv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.003 to 0.020 μm 3 /μm 2 . 13. A carrier-attached copper foil comprising a carrier, an interlayer, and an ultrathin copper layer in this order, wherein the projecting trough depth Svk as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm 2 at 220° C. for 2 hours is 0.051 to 0.478 μm, and the ratio Sv/Svk of maximum trough depth
Assignees
Inventors
Classifications
using masking means · CPC title
of copper · CPC title
Removing layers, or parts of layers, mechanically or chemically · CPC title
by special treatment of the metal · CPC title
- H05K3/025Primary
by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper · CPC title
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- What does patent US10299385B2 cover?
- Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum trough depth Sv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and…
- Who is the assignee on this patent?
- Jx Nippon Mining & Metals Corp
- What technology area does this patent fall under?
- Primary CPC classification H05K3/025. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 21 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).