Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device

Patent metadata

Field	Value
Publication number	US-10356898-B2
Application number	US-201615229197-A
Country	US
Kind code	B2
Filing date	Aug 5, 2016
Priority date	Aug 6, 2015
Publication date	Jul 16, 2019
Grant date	Jul 16, 2019

Abstract

Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum ridge height Sp as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.193 to 3.082 μm.

First claim

What is claimed is:

1. A carrier-attached copper foil comprising a carrier, an interlayer, and an ultrathin copper layer in this order, such that the carrier and the ultrathin copper layer each have an inner surface facing the interlayer and an outer surface;
wherein the outer surface of the ultrathin copper layer has a maximum ridge height, Sp, of 0.193 to 3.082 μm measured with a laser microscope according to ISO 25178; and
wherein the outer surface of the ultrathin copper layer has a maximum ridge height, Sp, and a projecting ridge height, Spk, measured with a laser microscope according to ISO 25178 such that a ratio Sp/Spk is 3.271 to 10.739.

2. The carrier-attached copper foil according to claim 1 , wherein the outer surface of the ultrathin copper layer has a level difference, Sk, of a core portion measured with a laser microscope according to ISO 25178 of 0.097 to 0.937 μm.

3. The carrier-attached copper foil according to claim 2 , wherein the outer surface of the ultrathin copper layer has a projecting ridge height, Spk, measured with a laser microscope according to ISO 25178 of 0.059 to 0.470 μm.

4. The carrier-attached copper foil according to claim 3 , wherein the outer surface of the ultrathin copper layer has an actual volume, Vmp, of a ridge portion measured with a laser microscope according to ISO 25178 of 0.003 to 0.024 μm 3 /μm 2 .

5. The carrier-attached copper foil according to claim 2 , wherein the outer surface of the ultrathin copper layer has an actual volume, Vmp, of a ridge portion measured with a laser microscope according to ISO 25178 of 0.003 to 0.024 μm 3 /μm 2 .

6. The carrier-attached copper foil according to claim 1 , wherein the outer surface of the ultrathin copper layer has a projecting ridge height, Spk, measured with a laser microscope according to ISO 25178 of 0.059 to 0.470 μm.

7. The carrier-attached copper foil according to claim 6 , wherein the outer surface of the ultrathin copper layer has an actual volume, Vmp, of a ridge portion measured with a laser microscope according to ISO 25178 of 0.003 to 0.024 μm 3 /μm 2 .

8. The carrier-attached copper foil according to claim 1 , wherein the outer surface of the ultrathin copper layer has an actual volume, Vmp, of a ridge portion measured with a laser microscope according to ISO 25178 of 0.003 to 0.024 μm 3 /μm 2 .

9. The carrier-attached copper foil according to claim 1 , wherein the outer surface of the ultrathin copper layer further has at least one of the following items (a) to (e):
(a) a maximum ridge height, Sp, measured with a laser microscope according to ISO 25178 of 0.193 to 2.4 μm,
(b) a level difference, Sk, of a core portion measured with a laser microscope according to ISO 25178 of 0.80 μm or less,
(c) a projecting ridge height, Spk, measured with a laser microscope according to ISO 25178 of 0.217 μm or less,
(d) an actual volume, Vmp, of a ridge portion measured with a laser microscope according to ISO 25178 of 0.018 μm 3 /μm 2 or less,
(e) a maximum ridge height, Sp, and a projecting ridge height, Spk, measured with a laser microscope according to ISO 25178 such that a ratio Sp/Spk is 3.271 to 8.41.

10. The carrier-attached copper foil according to claim 1 , wherein the outer surface of the ultrathin copper layer further has at least one of the following items (f) to (j):
(f) a maximum ridge height, Sp, measured with a laser microscope according to ISO 25178 of 0.193 to 1.53 μm,
(g) a level difference, Sk, of a core portion measured with a laser microscope according to ISO 25178 of 0.51 μm or less,
(h) a projecting ridge height, Spk, measured with a laser microscope according to ISO 25178 of 0.170 μm or less,
(i) an actual volume, Vmp, of a ridge portion measured with a laser microscope according to ISO 25178 of 0.010 μm 3 /μm 2 or less,
(j) a maximum ridge height, Sp, and a projecting ridge height, Spk, measured with a laser microscope according to ISO 25178 such that a ratio Sp/Spk is 3.271 to 7.00.

11. The carrier-attached copper foil according to claim 1 , wherein the outer surface of the ultrathin copper layer further has at least one of the following items (k) to (o):
(k) a maximum ridge height, Sp, measured with a laser microscope according to ISO 25178 of 0.193 to 0.700 μm,
(l) a level difference, Sk, of a core portion measured with a laser microscope according to ISO 25178 of 0.37 μm or less,
(m) a projecting ridge height, Spk, measured with a laser microscope according to ISO 25178 of 0.140 μm or less,
(n) an actual volume, Vmp, of a ridge portion as measured with a laser microscope according to ISO 25178 satisfying at least one of the following items (n1) to (n2):
(n1) 0.008 μm 3 /μm 2 or less,
(n2) 0.006 μm 3 /μm 2 or less,

(o) a maximum ridge height, Sp, and a projecting ridge height, Spk, measured with a laser microscope according to ISO 25178 such that a ratio Sp/Spk is 3.271 to 5.825.

12. The carrier-attached copper foil according to claim 1 , further comprising one or more layers selected from the group consisting of a roughening treatment layer, a heat-resistant layer, an antirust layer, a chromate treatment layer, and a silane coupling process layer,
said one or more layers being provided on the outer surface of the ultrathin copper layer, the outer surface of the carrier or both.

13. The carrier-attached copper foil according to claim 12 , wherein the roughening treatment layer is a layer comprised of a simple substance or an alloy containing one or more simple substances, and said simple substance is selected from the group consisting of copper, nickel, phosphorous, tungsten, arsenic, molybdenum, chromium, iron, vanadium, cobalt, and zinc.

14. The carrier-attached copper foil according to claim 12 , further comprising a resin layer provided on said one or more layers selected from the group consisting of a roughening treatment layer, a heat-resistant layer, an antirust layer, a chromate treatment layer, and a silane coupling process layer.

15. The carrier-attached copper foil according to claim 1 , further comprising a second interlayer and a second ultrathin copper layer, such that the outer surface of the carrier faces the second interlayer, and the second ultrathin copper layer has an inner surface facing the second interlayer and an outer surface.

16. The carrier-attached copper foil according to claim 15 , further comprising one or more layers selected from the group consisting of a roughening treatment layer, a heat-resistant layer, an antirust layer, a chromate treatment layer, and a silane coupling process layer, said one or more layers being provided on the outer surface of both ultrathin copper layers.

17. The carrier-attached copper foil according to claim 16 , wherein the roughening treatment layer is a layer comprised of a simple substance or an alloy containing one or more simple substances, and said simple substance is selected from the group consisting of copper, nickel, phosphorous, tungsten, arsenic, molybdenum, chromium, iron, vanadium, cobalt, and zinc.

18. The carrier-attached copper foil according to claim 16 , further comprising a resin layer provided on said one or more layers selected from the group consisting of a roughening treatment layer, a heat-resistant layer, an antirust layer, a chromate treatment layer, and a silane coupling process layer.

19. The carrier-attached copper foil according to claim 1 , which further comprises a resin layer provided on the outer surface of the ultrathin copper layer.

20. The carrier-attached copper foil of cl

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Miyamoto Nobuaki

Classifications

• H05K3/4007

  Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465) · CPC title

• H05K3/202

  using self-supporting metal foil pattern · CPC title

• H05K3/188

  by direct electroplating · CPC title

• B32B15/08

  of synthetic resin · CPC title

• H05K3/0035

  of blind holes, i.e. having a metal layer at the bottom · CPC title