Surface treated copper foil, copper clad laminate, and printed circuit board

Patent metadata

Field	Value
Publication number	US-11375624-B2
Application number	US-201916498003-A
Country	US
Kind code	B2
Filing date	Apr 22, 2019
Priority date	Apr 27, 2018
Publication date	Jun 28, 2022
Grant date	Jun 28, 2022

Abstract

A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has a Ni deposited amount of 20 to 200 μg/dm2 and a Zn deposited amount of 20 to 1,000 μg/dm2. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to the first surface treatment layer 3 of the surface treated copper foil 1.

First claim

The invention claimed is:

1. A surface treated copper foil comprising
a copper foil, and
a first surface treatment layer formed on one surface of the copper foil, and
a second surface treatment layer formed on the other surface of the copper foil,
wherein the first surface treatment layer comprises a Ni deposited amount of 20 to 200 μg/dm 2 and a Zn deposited amount of more than 300 μg/dm 2 to 1,000 μg/dm 2 , and the second surface treatment layer comprises a Zn deposited amount of 10 to 1000 μg/dm 2 .

2. The surface treated copper foil according to claim 1 , wherein the Ni deposited amount of the first surface treatment layer is from 20 to 180 μg/dm 2 .

3. The surface treated copper foil according to claim 2 , wherein the Ni deposited amount of the first surface treatment layer is from 30 to 100 μg/dm 2 .

4. The surface treated copper foil according to claim 1 , wherein the Zn deposited amount of the first surface treatment layer is from 346 to 700 μg/dm 2 .

5. The surface treated copper foil according to claim 4 , wherein the Zn deposited amount of the first surface treatment layer is from 346 to 500 μg/dm 2 .

6. The surface treated copper foil according to claim 1 , wherein the first surface treatment layer comprises a Co deposited amount of 30 μg/dm 2 or less.

7. The surface treated copper foil according to claim 1 , wherein the first surface treatment layer comprises Rz of 0.3 to 1.5 μm.

8. The surface treated copper foil according to claim 7 , wherein the Rz of the first surface treatment layer is from 0.4 to 1.2 μm.

9. The surface treated copper foil according to claim 7 , wherein the Rz of the first surface treatment layer is from 0.5 to 0.9 μm.

10. The surface treated copper foil according to claim 1 , wherein a ratio of the Ni deposited amount of the first surface treatment layer to a Ni deposited amount of the second surface treatment layer is 0.01 to 2.5.

11. The surface treated copper foil according to claim 10 , wherein the ratio of the Ni deposited amounts is from 0.6 to 2.2.

12. The surface treated copper foil according to claim 1 , wherein the copper foil is a rolled copper foil.

13. The surface treated copper foil according to claim 1 , wherein the first surface treatment layer is to be adhered to an insulating substrate.

14. A copper clad laminate comprising the surface treated copper foil according to claim 1 , and an insulating substrate adhered to the first surface treatment layer of the surface treated copper foil.

15. A printed circuit board comprising a circuit pattern formed by etching the surface treated copper foil of the copper clad laminate according to claim 14 .

16. The surface treated copper foil according to claim 5 , wherein a ratio of the Ni deposited amount of the first surface treatment layer to a Ni deposited amount of the second surface treatment layer is 0.01 to 2.5.

17. The surface treated copper foil according to claim 16 , wherein the ratio of the Ni deposited amounts is from 0.6 to 2.2.

18. The surface treated copper foil according to claim 17 , wherein the first surface treatment layer comprises a Co deposited amount of 30 μg/dm 2 or less.

19. The surface treated copper foil according to claim 18 , wherein the first surface treatment layer comprises Rz of 0.3 to 1.5 μm.

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Miyamoto Nobuaki
• Miki Atsushi

Classifications

• H05K2203/0307

  Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• H05K2201/0355

  Metal foils · CPC title

• C25D3/38

  of copper · CPC title

• C25D5/14

  two or more layers being of nickel or chromium, e.g. duplex or triplex layers · CPC title