Surface treated copper foil, copper clad laminate, and printed circuit board

Patent metadata

Field	Value
Publication number	US-11337315-B2
Application number	US-201916498032-A
Country	US
Kind code	B2
Filing date	Apr 22, 2019
Priority date	Apr 27, 2018
Publication date	May 17, 2022
Grant date	May 17, 2022

Abstract

A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has L* of a CIE L*a*b* color space of 44.0 to 84.0. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to a surface of the surface treated copper foil 1 opposite to the first surface treatment layer 3.

First claim

The invention claimed is:

1. A surface treated copper foil comprising
a copper foil,
a first surface treatment layer formed on one surface of the copper foil,
wherein the first surface treatment layer comprises a Zn deposited amount of 200 to 600 μg/dm 2 ,
a Cr deposited amount of 10 μg/dm 2 or more,
and a Ni deposited amount of 30 to 200 μg/dm 2 , and
a second surface treatment layer to be adhered to an insulating substrate, formed on the other surface of the copper foil,
wherein the first surface treatment layer comprises L* of a CIE L*a*b* color space of 44.0 to 84.0,
and the second surface treatment layer comprises a surface roughness Sa of 0.05 to 0.40 μm.

2. The surface treated copper foil according to claim 1 , wherein the L* of the first surface treatment layer is from 74.0 to 84.0.

3. The surface treated copper foil according to claim 1 , wherein the first surface treatment layer comprises a Cr deposited amount of 10 μg/dm 2 or more.

4. The surface treated copper foil according to claim 1 , wherein the first surface treatment layer comprises a Ni deposited amount of 30 to 200 μg/dm 2 .

5. The surface treated copper foil according to claim 1 , wherein the second surface treatment layer comprises a Ni deposited amount of 20 to 200 μg/dm 2 .

6. The surface treated copper foil according to claim 1 , wherein the second surface treatment layer comprises a Zn deposited amount of 20 to 1,000 μg/dm 2 .

7. A copper clad laminate comprising
the surface treated copper foil according to claim 1 , and
an insulating substrate adhered to the second surface treatment layer of the surface treated copper foil.

8. A printed circuit board comprising a circuit pattern formed by etching the surface treated copper foil of the copper clad laminate according to claim 7 .

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Miyamoto Nobuaki
• Miki Atsushi

Classifications

• B32B15/12

  of paper or cardboard · CPC title

• C25D11/38

  Chromatising · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• C25D5/14

  two or more layers being of nickel or chromium, e.g. duplex or triplex layers · CPC title

• H05K2203/0307

  Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites · CPC title