Molten solder injection head with vacuum filter and differential gauge system
US-11766729-B2 · Sep 26, 2023 · US
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Lewandowski Eric P patents
Lewandowski Eric P is listed as an inventor on 38 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lewandowski Eric P |
| Total patents | 38 |
| First publication | Mar 24, 2015 |
| Latest publication | Sep 26, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Permanent wafer handlers with through silicon vias for thermalization and qubit modification
US-11158781-B2 · Oct 26, 2021 · US
Permanent wafer handlers with through silicon vias for thermalization and qubit modification
US-2021159382-A1 · May 27, 2021 · US
Delivery device including reactive material for programmable discrete delivery of a substance
US-10881788-B2 · Jan 5, 2021 · US
Stud bumps for post-measurement qubit frequency modification
US-10692831-B1 · Jun 23, 2020 · US
Cathode for thin film microbattery
US-10686164-B2 · Jun 16, 2020 · US
Two-component bump metallization
US-10629797-B2 · Apr 21, 2020 · US
Method of forming a homogeneous solid metallic anode for a thin film microbattery
US-10622590-B2 · Apr 14, 2020 · US
Two-component bump metallization
US-10608158-B2 · Mar 31, 2020 · US
Method for forming solder bumps using sacrificial layer
US-10535592-B2 · Jan 14, 2020 · US
Recent patents
Latest publications not already listed above.
Two-component bump metallization
US-2019131510-A1 · May 2, 2019 · US
Two-component bump metallization
US-2019103542-A1 · Apr 4, 2019 · US
Molten Solder Injection Head with Vacuum Filter and Differential Gauge System
US-2019091786-A1 · Mar 28, 2019 · US
Homogeneous solid metallic anode for thin film microbattery
US-2019019997-A1 · Jan 17, 2019 · US
Cathode for thin film microbattery
US-2018331329-A1 · Nov 15, 2018 · US
Homogeneous solid metallic anode for thin film microbattery
US-10096802-B2 · Oct 9, 2018 · US
Cathode for thin film microbattery
US-10069116-B2 · Sep 4, 2018 · US
Method for forming solder bumps using sacrificial layer
US-2018218971-A1 · Aug 2, 2018 · US
Method for forming solder bumps using sacrificial layer
US-2018218970-A1 · Aug 2, 2018 · US
Method for forming solder bumps using sacrificial layer
US-9953908-B2 · Apr 24, 2018 · US
Cathode for thin film microbattery
US-2018040859-A1 · Feb 8, 2018 · US
Cathode for thin film microbattery
US-9806299-B2 · Oct 31, 2017 · US
Controlling fragmentation of chemically strengthened glass
US-9738560-B2 · Aug 22, 2017 · US
Method for forming solder bumps using sacrificial layer
US-2017125329-A1 · May 4, 2017 · US
Delivery Device Including Reactive Material For Programmable Discrete Delivery Of A Substance
US-2017119960-A1 · May 4, 2017 · US
Controlling fragmentation of chemically strengthened glass
US-9586857-B2 · Mar 7, 2017 · US
Wafer level overmold for three dimensional surfaces
US-9508566-B2 · Nov 29, 2016 · US
Thin, flexible microsystem with integrated energy source
US-9472789-B2 · Oct 18, 2016 · US
Controlling fragmentation of chemically strengthened glass
US-2016264456-A1 · Sep 15, 2016 · US
Controlling fragmentation of chemically strengthened glass
US-2016137548-A1 · May 19, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 37 |
| Globalfoundries Us 2 Llc | 1 |
| Fritz Gregory M | 1 |
| Lewandowski Eric P | 1 |
| Globalfoundries Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D1/04 | 12 |
| C25D1/22 | 12 |
| C25D5/50 | 12 |
| Y10T29/49108 | 12 |
| G02C7/083 | 12 |