Wafer level overmold for three dimensional surfaces

Patent metadata

Field	Value
Publication number	US-9508566-B2
Application number	US-201414460671-A
Country	US
Kind code	B2
Filing date	Aug 15, 2014
Priority date	Aug 15, 2014
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

Embodiments of the invention include a method for shaping a flexible integrated circuit to a curvature and the resulting structure. A flexible circuit is provided. An epoxy resin and amine composition is deposited on the flexible integrated circuit. The deposited epoxy resin and amine composition is B-staged. The flexible integrated circuit is placed within a mold of a curvature. The B-staged epoxy resin and amine composition is cured subsequent to placing the flexible integrated circuit within the mold of the curvature.

First claim

What is claimed is:

1. A method for shaping a flexible integrated circuit to a curvature, the method comprising:
providing a flexible integrated circuit, wherein the flexible integrated circuit includes a flexible substrate that is substantially straight;
depositing an epoxy resin and amine composition on the flexible integrated circuit, wherein the epoxy resin and amine composition is liquid;
B-staging the deposited epoxy resin and amine composition;
placing the flexible integrated circuit on a mold, such that, at least, the flexible substrate is bent to a curvature; and
curing the B-staged epoxy resin and amine composition subsequent to placing the flexible integrated circuit on the mold.

2. The method of claim 1 , further comprising:
affixing the provided flexible integrated circuit to a rigid carrier prior to the step of depositing the epoxy resin and amine composition on the flexible integrated circuit; and
detaching the flexible integrated circuit from the rigid carrier subsequent to B-staging the deposited epoxy resin and amine composition.

3. The method of claim 1 , wherein curing the B-staged epoxy resin and amine composition comprises heating the B-staged epoxy resin and amine composition.

4. The method of claim 1 , where placing the flexible integrated circuit on the mold further comprises:
holding the flexible integrated circuit in place on the mold with a vacuum.

5. The method of claim 4 , wherein the mold is beneath the flexible integrated circuit.

6. The method of claim 1 , wherein placing the flexible integrated circuit on the mold comprises:
placing the flexible integrated circuit in an area between a first mold portion of the mold and a second mold portion of the mold, wherein the area formed between the first mold portion and the second mold portion corresponds to the curvature.

7. The method of claim 1 , wherein the provided flexible integrated circuit comprises a plurality of integrated circuits on the flexible substrate, further comprising:
singulating each of the plurality of integrated circuits.

8. The method of claim 1 , wherein the step of curing the B-staged epoxy resin and amine composition continues until the B-staged epoxy resin and amine composition is cured fully.

9. The method of claim 1 , wherein the flexible integrated circuit is a System-on-Package.

10. The method of claim 1 , wherein providing the flexible integrated circuit comprises:
providing a flexible substrate that is substantially straight; and
bonding a die to the flexible substrate.

11. A method for shaping a flexible integrated circuit to a curvature, the method comprising:
providing a flexible integrated circuit, wherein the flexible integrated circuit includes a flexible substrate that is substantially straight;
applying a B-staged epoxy resin and amine composition film on the flexible integrated circuit;
placing the flexible integrated circuit on a mold, such that, at least, the flexible substrate is bent to a curvature; and
curing the B-staged epoxy resin and amine composition film subsequent to placing the flexible integrated circuit on the mold.

12. The method of claim 11 , further comprising:
affixing the provided flexible integrated circuit to a rigid carrier prior to the step of applying the B-staged epoxy resin and amine composition film; and
detaching the flexible integrated circuit from the rigid carrier subsequent to B-staging the deposited epoxy resin and amine composition.

13. The method of claim 11 , wherein curing the B-staged epoxy resin and amine composition film comprises heating the B-staged epoxy resin and amine composition film.

14. The method of claim 11 , where placing the flexible integrated circuit on the mold further comprises:
holding the flexible integrated circuit in place on the mold with a vacuum.

15. The method of claim 11 , wherein placing the flexible integrated circuit on the mold comprises:
placing the flexible integrated circuit in an area between a first mold portion of the mold and a second mold portion of the mold, wherein the area formed between the first mold portion and the second mold portion corresponds to the curvature.

16. The method of claim 11 , wherein the provided flexible integrated circuit comprises a plurality of integrated circuits on a substrate, further comprising:
singulating each of the plurality of integrated circuits.

17. The method of claim 11 , wherein the step of curing the B-staged epoxy resin and amine composition film continues until the B-staged epoxy resin and amine composition film is cured fully.

18. The method of claim 11 , wherein the flexible integrated circuit is a System-on-Package.

Assignees

• IBM

Inventors

• Andry Paul S
• Dang Bing
• Lewandowski Eric P
• Nah Jae-Woong
• Webb Bucknell C

Classifications

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/014

  using batch processing · CPC title

• H10W74/01

  Manufacture or treatment · CPC title

• H10W70/688

  Flexible insulating substrates · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title