Film covers for sensor packages
US-12568843-B2 · Mar 3, 2026 · US
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Koduri Sreenivasan Kalyani patents
Koduri Sreenivasan Kalyani is listed as an inventor on 54 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Koduri Sreenivasan Kalyani |
| Total patents | 54 |
| First publication | Oct 8, 2020 |
| Latest publication | Mar 3, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Integrated circuit device package
US-2025318338-A1 · Oct 9, 2025 · US
Integrated circuit device package
US-12389730-B2 · Aug 12, 2025 · US
Sensor package cavities with polymer films
US-12347738-B2 · Jul 1, 2025 · US
Miniature sensor cavities
US-2025164296-A1 · May 22, 2025 · US
Covers for semiconductor package components
US-2025149394-A1 · May 8, 2025 · US
Metal-lined package cavity for fluid sensors
US-2025076093-A1 · Mar 6, 2025 · US
Miniature sensor cavities
US-12203776-B2 · Jan 21, 2025 · US
Covers for semiconductor package components
US-12198995-B2 · Jan 14, 2025 · US
Three dimensional package for semiconductor devices and external components
US-12062597-B2 · Aug 13, 2024 · US
Recent patents
Latest publications not already listed above.
Film covers for sensor packages
US-2024243024-A1 · Jul 18, 2024 · US
Proximity sensor
US-2024178184-A1 · May 30, 2024 · US
Film covers for sensor packages
US-11972994-B2 · Apr 30, 2024 · US
Proximity sensor
US-11894339-B2 · Feb 6, 2024 · US
Covers for semiconductor package components
US-2024038609-A1 · Feb 1, 2024 · US
IC having a metal ring thereon for stress reduction
US-11869820-B2 · Jan 9, 2024 · US
Nanowires plated on nanoparticles
US-11869864-B2 · Jan 9, 2024 · US
Three dimensional package for semiconductor devices and external components
US-2023352373-A1 · Nov 2, 2023 · US
Coated semiconductor devices
US-11791248-B2 · Oct 17, 2023 · US
Dielectric and metallic nanowire bond layers
US-11791296-B2 · Oct 17, 2023 · US
Covers for semiconductor package components
US-11784103-B2 · Oct 10, 2023 · US
Semiconductor die orifices containing metallic nanowires
US-11728242-B2 · Aug 15, 2023 · US
Film covers for sensor packages
US-2023253277-A1 · Aug 10, 2023 · US
Nanomaterials for attaching mechanical force sensors
US-11714011-B2 · Aug 1, 2023 · US
Coated semiconductor devices
US-2023163050-A1 · May 25, 2023 · US
Film covers for sensor packages
US-11658083-B2 · May 23, 2023 · US
Three dimensional package for semiconductor devices and external components
US-11631632-B2 · Apr 18, 2023 · US
Sensor package cavities with polymer films
US-2023030266-A1 · Feb 2, 2023 · US
Coated semiconductor devices
US-11552006-B2 · Jan 10, 2023 · US
Ic having a metal ring thereon for stress reduction
US-2022336304-A1 · Oct 20, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Texas Instruments Inc | 54 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/111 | 29 |
| H10W90/756 | 28 |
| H10W72/884 | 23 |
| H10W90/736 | 21 |
| H10W70/421 | 20 |