Film covers for sensor packages

Patent metadata

Field	Value
Publication number	US-11658083-B2
Application number	US-202017116963-A
Country	US
Kind code	B2
Filing date	Dec 9, 2020
Priority date	Dec 9, 2020
Publication date	May 23, 2023
Grant date	May 23, 2023

Abstract

In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.

First claim

What is claimed is:

1. A sensor package, comprising:
a semiconductor die having a sensor;
a mold compound covering a portion of the semiconductor die;
a cavity formed in a top surface of the mold compound, the sensor in the cavity;
an adhesive abutting the top surface of the mold compound; and
a semi-permeable film abutting the adhesive and covering the cavity, the semi-permeable film approximately flush with at least four edges of the top surface of the mold compound, wherein the semi-permeable film is permeable to at least one fluid.

2. The sensor package of claim 1 , wherein the adhesive is approximately flush with the at least four edges of the top surface of the mold compound.

3. The sensor package of claim 1 , wherein the adhesive is exposed to an exterior of the sensor package at a corner of the top surface of the mold compound.

4. The sensor package of claim 3 , wherein the corner is in closer proximity to pin one of the sensor package than to any other pins of the sensor package.

5. The sensor package of claim 1 , wherein the semi-permeable film comprises polytetrafluoroethylene (PTFE).

6. The sensor package of claim 1 , wherein the semi-permeable film is permeable by a fluid from 100 nanometers to 10 microns.

7. The sensor package of claim 1 , wherein the semi-permeable film comprises an orifice that exposes the adhesive.

8. The sensor package of claim 7 , wherein a footprint of the orifice occupies a corner of the top surface.

9. The sensor package of claim 8 , wherein the orifice is triangular.

10. The sensor package of claim 7 , wherein the orifice is located away from edges of the top surface, the orifice being circumscribed by the semi-permeable film.

11. The sensor package of claim 10 , wherein the orifice is circular.

12. A sensor package, comprising:
a semiconductor die having a sensor;
a mold compound covering a portion of the semiconductor die, wherein:
an adhesive layer covers a top surface of the mold component;
a first film is disposed on the adhesive layer, the first film having at least one edge that is flush with at least one edge of the top surface of the mold compound, and
a second film is disposed on the first film; and

a cavity formed in the top surface of the mold compound, the sensor in the cavity.

13. The sensor package of claim 12 , wherein the adhesive layer has an adhesive strength ranging from 0.88 N/mm 2 to 1.81 N/mm 2 .

14. The sensor package of claim 12 , wherein the second film has an edge that is flush with the at least one edge of the top surface of the mold compound.

15. The sensor package of claim 12 , wherein the second film exposes a portion of the first film.

16. The sensor package of claim 12 , wherein the first film occupies a corner of the adhesive layer.

17. A sensor package, comprising:
a semiconductor die having a sensor;
a mold compound covering a portion of the semiconductor die;
a cavity formed in a top surface of the mold compound, the sensor in the cavity;
an adhesive abutting the top surface of the mold compound; and
a semi-permeable film abutting the adhesive and covering the cavity, the semi-permeable film approximately flush with at least four edges of the top surface of the mold compound, wherein:
the adhesive is exposed to an exterior of the sensor package at a corner of the top surface of the mold compound; and
the corner is in closer proximity to pin one of the sensor package than to any other pins of the sensor package.

18. The sensor package of claim 17 , wherein the semi-permeable film is permeable to at least one fluid.

19. The sensor package of claim 17 , wherein the adhesive is approximately flush with at least one edge of the top surface of the mold compound.

20. The sensor package of claim 17 , wherein the semi-permeable film comprises polytetrafluoroethylene (PTFE).

Assignees

• Texas Instruments Inc

Inventors

• Koduri Sreenivasan Kalyani
• Stark Leslie Edward
• Kummerl Steven Alfred
• Lee Wai

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W74/016

  using moulds · CPC title

• H10W70/6875

  being on a metallic substrate, e.g. insulated metal substrates [IMS] · CPC title

• H10W42/00

  Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title