Cationically photopolymerizable composition, bonding method, electronic device, method for manufacturing electronic device, display device and method for manufacturing display device
US-2017218236-A1 · Aug 3, 2017 · US
Film covers for sensor packages
US12568843B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12568843-B2 |
| Application number | US-202418618843-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 27, 2024 |
| Priority date | Dec 9, 2020 |
| Publication date | Mar 3, 2026 |
| Grant date | Mar 3, 2026 |
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- Title
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Abstract
Official abstract text for this publication.
In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.
First claim
Opening claim text (preview).
What is claimed is: 1 . A semiconductor package, comprising: a semiconductor die including a sensor; a mold compound covering a portion of the semiconductor die; a cavity formed through the mold compound over the sensor; an adhesive layer disposed over the mold compound; and a film disposed over the adhesive layer, wherein the film includes an orifice at a corner of a top surface of the semiconductor package. 2 . The semiconductor package of claim 1 , wherein the adhesive layer includes at least one edge that is flush with at least one edge of the mold compound. 3 . The semiconductor package of claim 1 , further comprising: a second cavity formed through the adhesive layer over the sensor. 4 . The semiconductor package of claim 1 , further comprising: a second cavity formed through the adhesive layer, wherein the second cavity is aligned with the cavity. 5 . The semiconductor package of claim 1 , wherein a corner of a top surface of the adhesive layer is exposed to an exterior of the semiconductor package. 6 . The semiconductor package of claim 1 , wherein the film includes at least one edge that is flush with at least one edge of the mold compound. 7 . The semiconductor package of claim 1 , wherein the film is a semi-permeable film. 8 . The semiconductor package of claim 7 , wherein the semi-permeable film covers the cavity. 9 . The semiconductor package of claim 1 , wherein the semiconductor package is a quad flat no-lead (QFN) style sensor package. 10 . A semiconductor package, comprising: a semiconductor die including a sensor; a mold compound covering at least a portion of the semiconductor die; a first cavity extending through the mold compound over the sensor; an adhesive layer disposed over the mold compound; a second cavity extending through the adhesive layer, the second cavity is aligned with the first cavity; and a film disposed over the adhesive layer, wherein the film includes an orifice at a corner of a top surface of the semiconductor package. 11 . The semiconductor package of claim 10 , wherein the adhesive layer includes at least one edge that is flush with at least one edge of the mold compound. 12 . The semiconductor package of claim 10 , wherein a corner of a top surface of the adhesive layer is exposed to an exterior of the semiconductor package. 13 . The semiconductor package of claim 10 , wherein the film includes at least one edge that is flush with at least one edge of the mold compound. 14 . The semiconductor package of claim 10 , wherein the film is a semi-permeable film that covers the first cavity and the second cavity. 15 . The semiconductor package of claim 10 , wherein the semiconductor package is a quad flat no-lead (QFN) style sensor package.
Assignees
Inventors
Classifications
- H10W90/00Primary
Package configurations · CPC title
comprising organic materials, e.g. plastics or resins · CPC title
using moulds · CPC title
being on a metallic substrate, e.g. insulated metal substrates [IMS] · CPC title
Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title
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Frequently asked questions
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- What does patent US12568843B2 cover?
- In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The …
- Who is the assignee on this patent?
- Texas Instruments Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 03 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).