Molten solder injection head with vacuum filter and differential gauge system
US-11766729-B2 · Sep 26, 2023 · US
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Knickerbocker John U patents
Knickerbocker John U is listed as an inventor on 209 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Knickerbocker John U |
| Total patents | 209 |
| First publication | Jan 29, 2015 |
| Latest publication | Sep 26, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding
US-11574835-B2 · Feb 7, 2023 · US
Miniaturized electronics package with patterned thin film solid state battery
US-11539081-B2 · Dec 27, 2022 · US
Miniaturized electronics package with patterned thin film solid state battery
US-11539080-B2 · Dec 27, 2022 · US
Handler bonding and debonding for semiconductor dies
US-11424152-B2 · Aug 23, 2022 · US
Simplified hermetic packaging of a micro-battery
US-11411272-B2 · Aug 9, 2022 · US
Simplified hermetic packaging of a micro-battery
US-11362382-B2 · Jun 14, 2022 · US
IR assisted fan-out wafer level packaging using silicon handler
US-11348833-B2 · May 31, 2022 · US
Strain gauge structure for a sensor
US-11268867-B2 · Mar 8, 2022 · US
Wafer level integration including design/co-design, structure process, equipment stress management and thermal management
US-11201138-B2 · Dec 14, 2021 · US
Recent patents
Latest publications not already listed above.
Saccade and vergence tracking for distance auto focus adjustment
US-11169399-B2 · Nov 9, 2021 · US
Handler bonding and debonding for semiconductor dies
US-11121005-B2 · Sep 14, 2021 · US
Heterogeneous miniaturization platform
US-11055459-B2 · Jul 6, 2021 · US
Smart pellet for sample testing
US-11039765-B2 · Jun 22, 2021 · US
Microchip substance delivery devices
US-11000474-B2 · May 11, 2021 · US
Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding
US-10998217-B2 · May 4, 2021 · US
Drug delivery device having a cavity sealed by a pressurized membrane
US-10940265-B2 · Mar 9, 2021 · US
Wafer level integration including design/co-design, structure process, equipment stress management, and thermal management
US-10811305-B2 · Oct 20, 2020 · US
Integrated wafer-level processing system
US-10748877-B2 · Aug 18, 2020 · US
Probe structure for physiological measurements using surface enhanced Raman spectroscopy
US-10694951-B2 · Jun 30, 2020 · US
Probe structure for physiological measurements using surface enhanced Raman spectroscopy
US-10694950-B2 · Jun 30, 2020 · US
Miniaturized electronics package with patterned thin film solid state battery
US-2020194841-A1 · Jun 18, 2020 · US
Method of forming a plurality of electro-optical module assemblies
US-10687425-B2 · Jun 16, 2020 · US
Miniaturized electronics package with patterned thin film solid state battery
US-2020185781-A1 · Jun 11, 2020 · US
Handler bonding and debonding for semiconductor dies
US-10679887-B2 · Jun 9, 2020 · US
Handler bonding and debonding for semiconductor dies
US-2020176297-A1 · Jun 4, 2020 · US
Integrated electro-optical module assembly
US-10670656-B2 · Jun 2, 2020 · US
Handler bonding and debonding for semiconductor dies
US-2020168475-A1 · May 28, 2020 · US
Chip handling and electronic component integration
US-10658182-B2 · May 19, 2020 · US
Wafer level integration including design/co-design, structure process, equipment stress management and thermal management
US-10651134-B2 · May 12, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 207 |
| Globalfoundries Inc | 3 |
| Andry Paul S | 1 |
| Cotte John M | 1 |
| Knickerbocker John U | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/0198 | 63 |
| H10P72/74 | 62 |
| H10P72/7416 | 54 |
| H10P72/744 | 53 |
| H10W90/00 | 50 |