Strain gauge structure for a sensor

US11268867B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11268867-B2
Application numberUS-201715844694-A
CountryUS
Kind codeB2
Filing dateDec 18, 2017
Priority dateDec 18, 2017
Publication dateMar 8, 2022
Grant dateMar 8, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

Official abstract text for this publication.

According to an embodiment of the present invention, a structure for a strain gauge device is provided. The structure comprises a layer of strain gauge material and one or more contact pads positioned directly on the layer of strain gauge material. The structure further comprises a multiplexer, measuring device, amplifier, analog to digital converter, microcontroller, and wireless adapter. According to the structure, the multiplexer selects a given contact pad pair of the one or more contact pad pairs, the measuring device measures signal generated by the layer of strain gauge material between the given contact pad pair, the amplifier amplifies the measured signal, the analog to digital converter converts the amplified analog signal to a digital signal, the microcontroller processes the digital signal, and the wireless adapter transmits the processed digital signal. In addition, the structure may further comprise a battery to provide energy to the structure.

First claim

Opening claim text (preview).

What is claimed is: 1. A wearable structure for a strain gauge device, wherein the wearable structure is attached to a human body, the structure comprising: a layer of piezoelectric material and three or more contact pads positioned directly on the layer of piezoelectric material, wherein an initial resistance between each pair of contact pads from among the three or more contact pads is equal; and the layer of piezoelectric material and the three or more contact pads operatively connected to a multiplexer, a measuring device, an amplifier, an analog to digital converter, a microcontroller, and a wireless adapter. 2. The structure of claim 1 , wherein the multiplexer selects two or more pairs of the three or more contact pads, the measuring device measures an analog signal corresponding to the layer of piezoelectric material between the two or more pairs of contact pads, the amplifier amplifies the analog signal, the analog to digital converter converts the amplified signal to a digital signal, the microcontroller processes the digital signal, and the wireless adapter transmits the processed digital signal. 3. The structure of claim 2 , further comprising an energy source to provide energy to the structure. 4. The structure of claim 2 , wherein a first pair of the two or more pairs of contact pads measure a first signal produced by the piezoelectric material in a first direction, and wherein a second pair of the two or more pairs of contact pads measure a second signal produced by the piezoelectric material in a second direction, thereby forming a two-dimensional strain field based on the measured signals and coordinates of the three or more contact pads. 5. The structure of claim 4 , wherein a third signal in a third direction is inferred from the first signal in the first direction and the second signal in the second direction. 6. The structure of claim 5 , wherein a malfunctioning contact pad is identified by comparing the inferred third signal in the third direction to a third signal measured by a contact pad in the third direction. 7. The structure of claim 2 , wherein a change in the signal corresponding to the layer of piezoelectric material between the two or more pairs of contact pads is indicative of a change in strain corresponding to the layer of piezoelectric material between the two or more pairs of contact pads. 8. The structure of claim 1 , wherein the three or more contact pads are positioned in a non-linear configuration. 9. A wearable structure for a strain gauge device, wherein the wearable structure is attached to a human body, the structure comprising: a layer of piezoresistive material and three or more contact pads positioned directly on the layer of piezoresistive material, wherein an initial resistance between each pair of contact pads from among the three or more contact pads is equal; and the layer of piezoresistive material and the three or more contact pads operatively connected to a multiplexer, a measuring device, an amplifier, an analog to digital converter, a microcontroller, and a wireless adapter. 10. The structure of claim 9 , wherein the multiplexer selects two or more pairs of the three or more contact pads, the measuring device measures an analog signal corresponding to the layer of piezoresistive material between two or more pairs of contact pads, the amplifier amplifies the analog signal, the analog to digital converter converts the amplified signal to a digital signal, the microcontroller processes the digital signal, and the wireless adapter transmits the processed digital signal. 11. The structure of claim 10 , further comprising an energy source to provide energy to the structure. 12. The structure of claim 10 , wherein a first pair of the two or more pairs of contact pads measure a first signal produced by the piezoresistive material in a first direction, and wherein a second pair of the two or more pairs of contact pads measure a second signal produced by the piezoresistive material in a second direction, thereby forming a two-dimensional strain field based on the measured signals and coordinates of the three or more contact pads. 13. The structure of claim 12 , wherein a third signal in a third direction is inferred from the first signal in the first direction and the second signal in the second direction. 14. The structure of claim 13 , wherein a malfunctioning contact pad is identified by comparing the inferred third signal in the third direction to a third signal measured by a contact pad in the third direction. 15. The structure of claim 10 , wherein a change in the signal corresponding to the layer of piezoresistive material between the one or more pairs of contact pads is indicative of a change in strain corresponding to the layer of piezoresistive material between the two or more pairs of contact pads. 16. The structure of claim 12 , wherein the layer of piezoresistive material is doped such that the first signal is equal to the second signal when the layer of piezoresistive material is unstrained. 17. The structure of claim 9 , wherein the three or more contact pads are positioned in a non-linear configuration. 18. The structure of claim 9 , wherein the measuring device comprises at least one of a Wheatstone bridge and a four point Kevin probe.

Assignees

Inventors

Classifications

  • G01L1/18Primary

    using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material · CPC title

  • using properties of piezoelectric devices · CPC title

  • Special supports with preselected places to mount the resistance strain gauges; Mounting of supports · CPC title

  • Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature (G01L9/025, G01L9/045, G01L9/065, G01L9/085, G01L9/105, G01L9/125, G01L19/02, G01L19/04 take precedence; measuring two or more variable G01D21/02; temperature sensors with pressure compensation G01K1/26) · CPC title

  • of piezo-resistive devices · CPC title

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What does patent US11268867B2 cover?
According to an embodiment of the present invention, a structure for a strain gauge device is provided. The structure comprises a layer of strain gauge material and one or more contact pads positioned directly on the layer of strain gauge material. The structure further comprises a multiplexer, measuring device, amplifier, analog to digital converter, microcontroller, and wireless adapter. Acco…
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification G01L1/18. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 08 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).