Miniaturized electronics package with patterned thin film solid state battery

Patent metadata

Field	Value
Publication number	US-11539081-B2
Application number	US-202016800327-A
Country	US
Kind code	B2
Filing date	Feb 25, 2020
Priority date	May 3, 2017
Publication date	Dec 27, 2022
Grant date	Dec 27, 2022

Abstract

A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.

First claim

What is claimed is:

1. A method for integrating a thin film microbattery with electronic circuitry, the method comprising:
forming a release layer over a handler;
forming a thin film microbattery over the release layer of the handler;
removing the thin film microbattery from the handler;
depositing the thin film microbattery on an interposer;
disposing electronic circuitry on the interposer; and
sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules,
wherein the thin film microbattery is disposed directly between the electronic circuitry and wherein all of the electronic circuitry directly contacts and extends above a topmost surface of the interposer.

2. The method of claim 1 , wherein all the electronic circuitry is collinear with respect to each other and with the thin film microbattery.

3. The method of claim 1 , further comprising electrically connecting the thin film microbattery and the electronic circuitry by electrical connections formed within the interposer.

4. The method of claim 1 , further comprising removing the thin film microbattery from the handler by a low-power laser device.

5. The method of claim 1 , further comprising forming the thin film microbattery via a shadow mask positioned either in a non-engaging relationship with the handler or in direct contact with the handler.

6. The method of claim 1 , further comprising incorporating the microbattery modules into wearable, implantable, ingestible electronic devices.

7. The method of claim 6 , wherein the wearable, implantable, ingestible electronic devices enable at least health and fitness monitoring.

8. The method of claim 1 , wherein the thin film microbattery is manufactured by batch processing.

9. The method of claim 1 , wherein the thin film microbattery is manufactured by sputtering and evaporation techniques.

10. The method of claim 1 , wherein the thin film microbattery includes at least a cathode current collector, a cathode, a solid state electrolyte, an anode, and an anode current collector.

11. A method for integrating a thin film microbattery with electronic circuitry, the method comprising:
forming a release layer over a handler;
forming a thin film microbattery over the release layer of the handler;
removing the thin film microbattery from the handler;
depositing the thin film microbattery on an interposer; and
disposing electronic circuitry on the interposer;
wherein the thin film microbattery is disposed directly between the electronic circuitry and wherein all of the electronic circuitry directly contacts and extends above a topmost surface of the interposer.

12. The method of claim 11 , further comprising sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.

13. The method of claim 12 , further comprising incorporating the microbattery modules into wearable, implantable, ingestible electronic devices.

14. The method of claim 13 , wherein the wearable, implantable, ingestible electronic devices enable at least health and fitness monitoring.

15. The method of claim 11 , wherein all the electronic circuitry is collinear with respect to each other and with the thin film microbattery.

16. The method of claim 11 , further comprising electrically connecting the thin film microbattery and the electronic circuitry by electrical connections formed within the interposer.

17. The method of claim 11 , further comprising removing the thin film microbattery from the handler by a low-power laser device.

18. The method of claim 11 , further comprising forming the thin film microbattery via a shadow mask positioned either in a non-engaging relationship with the handler or in direct contact with the handler.

19. The method of claim 11 , wherein the thin film microbattery is manufactured by batch processing.

20. The method of claim 11 , wherein the thin film microbattery is manufactured by sputtering and evaporation techniques.

Assignees

• IBM

Inventors

• Chen Qianwen
• Dang Bing
• Knickerbocker John U

Classifications

• A61B2562/166

  the sensor is mounted on a specially adapted printed circuit board · CPC title

• H01M10/052

  Li-accumulators · CPC title

• Y02E60/10

  Energy storage using batteries · CPC title

• H01M10/0585 Primary

  of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators · CPC title

• H01M10/0436

  Small-sized flat cells or batteries for portable equipment · CPC title