Handler bonding and debonding for semiconductor dies

Patent metadata

Field	Value
Publication number	US-11424152-B2
Application number	US-202016779783-A
Country	US
Kind code	B2
Filing date	Feb 3, 2020
Priority date	Dec 30, 2015
Publication date	Aug 23, 2022
Grant date	Aug 23, 2022

Abstract

Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.

First claim

What is claimed is:

1. A system for processing semiconductor devices, the system comprising:
memory;
at least one processor operatively coupled to the memory;
at least one control unit operatively coupled to the memory and the at least one processor, the at least one control unit operating at least one semiconductor device processing component; and
a semiconductor package comprising:
at least one singulated semiconductor device bonded to a handler;
a release layer in direct contact with the handler, wherein the release layer is vulnerable to ablation and comprises at least one additive material therein, the at least one additive material adjusts a frequency of electro-magnetic radiation absorption property of the release layer; and
an insulating layer situated between the release layer and the at least one singulated semiconductor device,

wherein the at least one control unit operates the at least one semiconductor device processing component to:
bond the at least one singulated semiconductor device to the handler;
package the at least one singulated semiconductor device while it is bonded to the handler;
ablate the release layer by irradiating the release layer through the handler with a laser; and
remove the at least one singulated semiconductor device from the handler after the release layer has been ablated.

2. The system for processing semiconductor devices of claim 1 , wherein the semiconductor package comprises an adhesive layer, that is distinct from the release layer, between the at least one singulated semiconductor device and the release layer.

3. The system for processing semiconductor devices of claim 1 , wherein the at least one additive material comprises a single additive material, wherein the single additive material is one of chemical absorber for a 355 nm wavelength and a chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm, and wherein the single additive material is effective at room temperature to a temperature greater than 250° C. and is thermally stable at a temperature ≥250° C.

4. The system for processing semiconductor devices of claim 1 , wherein the at least one additive material comprises a first additive material and a second additive material, wherein the first additive material is a chemical absorber for a 355 nm wavelength and the second additive material is a chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm, and wherein the each of the first and second additive materials is thermally stable at a temperature ≥250° C.

5. The system for processing semiconductor devices of claim 1 , wherein the at least one additive material comprises one of a single additive material or multiple additive materials.

6. The system for processing semiconductor devices of claim 1 , wherein the insulating layer is separate from any adhesive layer within and/or in contact with the release layer.

Assignees

• IBM

Inventors

• Andry Paul S
• Dang Bing
• Gelorme Jeffrey Donald
• Hung Li-Wen
• Knickerbocker John U
• Tsang Cornelia Kang-I

Classifications

• H10P72/7436

  used to support a device or a wafer when forming electrical connections thereto · CPC title

• H10P72/7412

  the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title