Handler bonding and debonding for semiconductor dies

Patent metadata

Field	Value
Publication number	US-10679887-B2
Application number	US-201815935537-A
Country	US
Kind code	B2
Filing date	Mar 26, 2018
Priority date	Dec 30, 2015
Publication date	Jun 9, 2020
Grant date	Jun 9, 2020

Abstract

Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.

First claim

What is claimed is:

1. A method for processing semiconductor devices, the method comprising:
applying a release layer to a handler, wherein the release layer comprises at least one additive material, the at least one additive material adjusts a frequency of electro-magnetic radiation absorption property of the release layer,
wherein the at least one additive material is:

where R is one of methylcyclohexane and n-butyl;
bonding at least one singulated semiconductor device to the handler;
packaging the at least one singulated semiconductor device while it is bonded to the handler;
ablating the release layer by irradiating the release layer through the handler with a laser; and
removing the at least one singulated semiconductor device from the handler after the release layer has been ablated.

2. The method of claim 1 , wherein the at least one additive material comprises a single additive material, wherein the single additive material is one of chemical absorber for a 355 nm wavelength and a chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm, and wherein the single additive material additive material is effective at room temperature to a temperature greater than 250° C. and is thermally stable at a temperature ≥250° C.

3. The method of claim 1 , wherein the at least one additive material comprises a first additive material and a second additive material, wherein the first additive material is a chemical absorber for a 355 nm wavelength and the second additive material is a chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm, and wherein the each of the first and second additive materials is thermally stable at a temperature ≥250° C.

4. The method of claim 1 , wherein the at least one additive material is a 355 nm chemical absorber in a phenoxy base material.

5. The method of claim 1 , wherein the at least one additive is chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm and fully soluble in cyclohexanone.

6. The method of claim 1 , further comprising:
forming a dielectric layer on the release layer prior to bonding the at least one singulated semiconductor device, wherein the dielectric layer is situated between the release layer and the at least one singulated semiconductor device.

7. The method of claim 1 , further comprising:
applying an adhesive layer, that is distinct from the release layer, between the at least one singulated semiconductor device and the release layer.

8. The method of claim 1 , wherein light radiated from the laser has a wavelength of approximately 250 nm to 5000 nm.

9. A method for processing semiconductor devices, the method comprising:
applying a release layer to a handler, wherein the release layer comprises at least one additive material, the at least one additive material adjusts a frequency of electro-magnetic radiation absorption property of the release layer, wherein the at least one additive material is 2, 5-Bis(2-benzimidazolyl)-pyridine;
building semiconductor packaging components on the release layer;
bonding at least one singulated semiconductor device to the semiconductor packaging components;
ablating the release layer by irradiating the release layer through the handler with a laser; and
removing the at least one singulated semiconductor device from the handler after the release layer has been ablated.

10. The method of claim 9 , wherein the at least one additive material comprises a single additive material, wherein the single additive material is one of chemical absorber for a 355 nm wavelength and a chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm, and wherein the single additive material is effective at room temperature to a temperature greater than 250° C. and is thermally stable at a temperature ≥250° C.

11. The method of claim 9 , wherein the at least one additive material comprises a first additive material and a second additive material, wherein the first additive material is a chemical absorber for a 355 nm wavelength and the second additive material is a chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm, and wherein the each of the first and second additive materials is thermally stable at a temperature ≥250° C.

12. The method of claim 9 , wherein the at least one additive material is a 355 nm chemical absorber in a phenoxy base material.

13. The method of claim 9 , wherein the at least one additive is chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm and fully soluble in cyclohexanone.

14. A method for processing semiconductor devices, the method comprising:
applying a release layer to a handler, wherein the release layer comprises at least one additive material, the at least one additive material adjusts a frequency of electro-magnetic radiation absorption property of the release layer,
wherein the at least one additive material is:

where R is one cyclohexane and n-butyl;
building semiconductor packaging components on the release layer;
bonding at least one singulated semiconductor device to the semiconductor packaging components;
ablating the release layer by irradiating the release layer through the handler with a laser; and
removing the at least one singulated semiconductor device from the handler after the release layer has been ablated.

15. The method of claim 14 , wherein the at least one additive material comprises a single additive material, wherein the single additive material is one of chemical absorber for a 355 nm wavelength and a chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm, and wherein the single additive material additive material is effective at room temperature to a temperature greater than 250° C. and is thermally stable at a temperature ≥250° C.

16. The method of claim 14 , wherein the at least one additive material comprises a first additive material and a second additive material, wherein the first additive material is a chemical absorber for a 355 nm wavelength and the second additive material is a chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm, and wherein the each of the first and second additive materials is thermally stable at a temperature ≥250° C.

17. The method of claim 14 , wherein the at least one additive material is a 355 nm chemical absorber in a phenoxy base material.

18. The method of claim 14 , wherein the at least one additive is chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm and fully soluble in cyclohexanone.

19. The method of claim 14 , further comprising:
forming a dielectric layer on the release layer prior to bonding the at least one singulated semiconductor device, wherein the dielectric layer is situated between the release layer and the at least one singulated semiconductor device.

20. The method of claim 14 , wherein light radiated from the laser has a wavelength of approximately 250 nm to 5000 nm.

Assignees

• IBM

Inventors

• Andry Paul S
• Dang Bing
• Gelorme Jeffrey Donald
• Hung Li-Wen
• Knickerbocker John U
• YANG Cornelia Tsang

Classifications

• H01L21/78

  Electricity · mapped topic

• H01L2221/68381

  Electricity · mapped topic

• H01L2221/68372

  Electricity · mapped topic

• H01L21/6835

  Electricity · mapped topic

• H01L2224/32145

  Electricity · mapped topic