Miniaturized electronics package with patterned thin film solid state battery

Patent metadata

Field	Value
Publication number	US-11539080-B2
Application number	US-202016787167-A
Country	US
Kind code	B2
Filing date	Feb 11, 2020
Priority date	May 3, 2017
Publication date	Dec 27, 2022
Grant date	Dec 27, 2022

Abstract

A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.

First claim

What is claimed is:

1. A structure for integrating a thin film microbattery with electronic circuitry, the structure comprising:
a thin film microbattery;
an interposer electrically connected to the thin film microbattery;
electronic circuitry disposed on the interposer; and
a seal formed over the thin film microbattery and the electronic circuitry to create individual microbattery modules;
wherein the thin film microbattery is disposed directly between the electronic circuitry and wherein all of the electronic circuitry directly contacts and extends above a topmost surface of the interposer.

2. The structure of claim 1 , wherein all the electronic circuitry is collinear with respect to each other and with the thin film microbattery.

3. The structure of claim 1 , wherein the thin film microbattery includes at least a cathode current collector, a cathode, a solid state electrolyte, an anode, and an anode current collector.

4. The structure of claim 1 , wherein the thin film microbattery and the electronic circuitry are electrically connected by electrical connections formed within the interposer.

5. The structure of claim 1 , wherein the thin film microbattery is removed from the handler by a low-power laser device.

6. The structure of claim 1 , wherein the thin film microbattery is formed via a shadow mask positioned either in a non-engaging relationship with the handler or in direct contact with the handler.

7. The structure of claim 1 , wherein the microbattery modules are incorporated into wearable electronic devices.

8. The structure of claim 7 , wherein the wearable electronic devices enable at least health and fitness monitoring.

9. The structure of claim 1 , wherein the thin film microbattery is manufactured by batch processing.

10. The structure of claim 1 , wherein the thin film microbattery is manufactured by sputtering and evaporation techniques.

11. A structure for integrating a thin film microbattery with electronic circuitry, the structure comprising:
a thin film microbattery electrically connected to an interposer; and
electronic circuitry disposed on the interposer after complete formation of the thin-film microbattery;
wherein the thin film microbattery is disposed directly between the electronic circuitry and wherein all of the electronic circuitry directly contacts and extends above a topmost surface of the interposer.

12. The structure of claim 11 , wherein all the electronic circuitry is collinear with respect to each other and with the thin film microbattery.

13. The structure of claim 12 , wherein a seal is formed over the thin film microbattery and the electronic circuitry to create individual microbattery modules.

14. The structure of claim 13 , wherein the microbattery modules are incorporated into wearable, implantable, or ingestible electronic devices.

15. The structure of claim 14 , wherein the wearable, implantable, or ingestible electronic devices enable at least health and fitness monitoring.

16. The structure of claim 11 , wherein the thin film microbattery includes at least a cathode current collector, a cathode, a solid state electrolyte, an anode, and an anode current collector.

17. The structure of claim 11 , wherein a protective layer covers the thin film microbattery.

18. The structure of claim 11 , wherein the thin film microbattery and the electronic circuitry are electrically connected by electrical connections formed within the interposer.

19. The structure of claim 11 , wherein the thin film microbattery is formed via a shadow mask positioned either in a non-engaging relationship with the interposer or in direct contact with the interposer.

20. The structure of claim 11 , wherein the thin film microbattery is manufactured by batch processing.

Assignees

• IBM

Inventors

• Chen Qianwen
• Dang Bing
• Knickerbocker John U

Classifications

• H01M10/052

  Li-accumulators · CPC title

• A61B2560/0214

  of power generation or supply · CPC title

• A61B2562/166

  the sensor is mounted on a specially adapted printed circuit board · CPC title

• H01M10/0585 Primary

  of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators · CPC title

• A61B5/681

  Wristwatch-type devices · CPC title